Solid-state image pickup apparatus, solid-state image sensor chip and package

Abstract

A solid-state image pickup apparatus comprises a solid-state image sensor chip contained in a package. The solid-state image sensor chip has a first pad electrode arranged on one side edge and a second pad electrode arranged on another side edge, the first pad electrode and the second pad electrode being connected by interconnections in the package. By using the package interconnections, the interconnections in the chip can be simplified and the chip size can be reduced.

1 . A solid-state image pickup apparatus comprising: 
 a solid-state image sensor chip which is contained in a package and has a first pad electrode arranged on its one side edge and a second pad electrode arranged on its another side edge,    wherein said first pad electrode and said second pad electrode are connected by interconnections in said package.    
   
   
       2 . The solid-state image pickup apparatus according to  claim 1 , wherein said first and second pad electrodes are arranged at mutually opposing positions and function according to an identical signal.  
   
   
       3 . The solid-state image pickup apparatus according to  claim 2 , wherein said package has, around its outer peripheries, external terminals that connect to interconnections in said package and also connect to external devices, said external terminals being arranged along a first outer periphery and a second outer periphery of the package, facing said side edge and said other side edge respectively.  
   
   
       4 . The solid-state image pickup apparatus according to  claim 3 , wherein, regarding the corresponding first pad electrode and the second pad electrode as one unit, said external terminals are alternately arranged on said first outer periphery and said second outer periphery for every unit.  
   
   
       5 . The solid-state image pickup apparatus according to  claim 1 , wherein said package has, around its outer peripheries, external terminals that connect to interconnections in said package and also connect to external devices, said external terminals being arranged along a first outer periphery and a second outer periphery of the package, facing said side edge and said other side edge respectively.  
   
   
       6 . The solid-state image pickup apparatus according to  claim 5 , wherein, regarding the corresponding first pad electrode and the second pad electrode as one unit, said external terminals are alternately arranged on said first outer periphery and said second outer periphery for every unit.  
   
   
       7 . A solid-state image sensor chip comprising: 
 a plurality of function units that execute predetermined functions with respect to an image pickup unit; and    a plurality of electrode pads connected to the function units;    wherein said plurality of electrode pads are arranged along opposing side edges, and the plurality of electrode pads, that are connected to the plurality of function units that function according to an associated one of identical signals, are arranged along approximately identical lines.    
   
   
       8 . A package that holds a solid-state image sensor chip, said solid-state image sensor chip comprising a plurality of function units that execute predetermined functions with respect to an image pickup unit, and a plurality of electrode pads connected to the function units; said plurality of electrode pads being arranged along opposing side edges, and the plurality of electrode pads, that are connected to the plurality of function units that function according to an associated one of identical signals, being arranged along approximately identical lines; and 
 interconnections being provided to connect said first electrode pad and said second electrode pad that function according to said associated one of said identical signals, among said pad electrodes arranged on said side edge and said pad electrodes arranged on said other side edge.    
   
   
       9 . The package according to  claim 8 , further comprising, around its outer peripheries, external terminals that connect to the interconnections and also connect to external devices, wherein said external terminals are arranged along a first outer periphery and a second outer periphery of said package, said first outer periphery and said second outer periphery facing said side edge and said other side edge, respectively.  
   
   
       10 . The package according to  claim 9 , wherein, regarding the corresponding first pad electrode and the second pad electrode as one unit, said external terminals are alternately arranged on said first outer periphery and said second outer periphery for every unit.