Semiconductor inspection apparatus and tray for inspection parts used thereof

Abstract

A tray of parts for inspection has a simple structure having only a tray holder that has a plurality of groove sections that store a plurality of parts for inspection on the surface, and contact sections, comprised in each groove, which have the conductor to electrically connect the electrodes of the stored parts for inspection in each groove section extends to the back surface. Under conditions where the plurality of parts for inspection are stored in the tray of parts for inspection, such tray is held by the tray holder, and the plurality of probe needles are placed on the plurality of contact sections equipped by the tray of parts for inspection all at once. Through this, electrical examination of a plurality of parts for inspection can be simultaneously performed.

1 . A semiconductor inspection apparatus comprising: 
 a tray holder that holds a tray for inspection parts, said tray is equipped with a plurality of grooves that store a plurality of parts for inspection on the surface and contact sections comprised in each groove,    said contact sections have the conductor used to electrically connect the electrodes of said parts for inspection stored in said each groove extends to the back surface of said tray;    a probe with a plurality of needles that come into contact with said plurality of contact sections that extend to the back surface of said tray for inspection parts held by said tray holder all at once; and    a controller that controls movements of said probe so that the needles of said probe will come into contact with said contact sections.    
   
   
       2 . The semiconductor inspection apparatus according to  claim 1;   wherein said tray holder holds said tray for inspection parts so that the surface of said tray for inspection parts faces upward; and    the needles of said probe are formed so as to come into contact with said contact sections of the back surface of said tray for inspection parts from the lower portion of said tray for inspection parts held by said tray holder.    
   
   
       3 . The semiconductor inspection apparatus according to  claim 1;   wherein said tray holder holds said tray for inspection parts so that the surface of said tray for inspection parts faces downward; and    the needles of said probe are formed to come into contact with said contact sections of the back surface of said tray for inspection parts from the upper portion of said tray for inspection parts held by said tray holder.    
   
   
       4 . A tray for inspection parts comprising: 
 a plurality of grooves that store a plurality of parts for inspection on the surface; and    contact sections comprised in each groove,    said contact sections have the conductor that electrically connects the electrodes of said parts for inspection stored in said each groove extends to the back surface.    
   
   
       5 . The tray for inspection parts according to  claim 4 , 
 wherein a side wall of said each groove has a slope,    the area of the bottom surface is formed to so be smaller that of an open end of said each groove,    longitudinal and transversal dimensions of the open end of each said groove are slightly larger than those of said parts for inspection, and    longitudinal and transversal dimensions of the bottom surface of said each groove are almost equivalent to those of said part for inspection.    
   
   
       6 . The tray for inspection parts according to  claim 4  further comprising: 
 a press member that presses and fixes said parts for inspection so that said parts for inspection stored in said each groove will not move.