Film forming apparatus and film forming method
Abstract
An apparatus for forming a film on a wafer comprising, a first coating apparatus coating a foaming insulation film material on the wafer, a second coating apparatus coating a non-porous insulation film material on the wafer, a low oxygen heating temperature regulating process apparatus performing a heating process on the wafer on which the foaming insulation film material is coated, a low oxygen high temperature heating process apparatus performing the heating process on the water on which the non-foaming insulation film material is coated, a transfer mechanism transferring the wafer to these apparatuses, and a selecting means selecting a path to which the wafer is transferred corresponding to the film formed on the wafer.
Claims
exact text as granted — not AI-modified1 . An apparatus for forming a film on a substrate, comprising:
a first coating apparatus coating a foaming material on the substrate; a second coating apparatus coating an insulation material on the substrate; a first heating apparatus heating the substrate on which the foaming material is coated so as to form a porous insulation film thereon; a second heating apparatus heating the substrate on which the insulation material is coated so as to form a non-porous insulation film thereon; transferring means for transferring the substrate into at least one of the first coating apparatus, the second coating apparatus, the first heating apparatus and the second heating apparatus; and selecting means for selecting one of the first coating apparatus and the second coating apparatus, one of the first heating apparatus and the second heating apparatus to which the substrate is transferred to corresponding to the film formed on the substrate.
2 . The apparatus as set forth in claim 1 , wherein at least one of the first coating apparatus and the second coating apparatus performs coating with a spin coat process.
3 . The film forming apparatus as set forth in claim 1 , wherein the selecting means selects a path to which the substrate is transferred to so that layers of insulation films are formed on the substrate in the order of the porous film made of the foaming material, the non-porous film made of the insulation material and the porous film made of the foaming material.
4 . The apparatus as set forth in claim 1 , wherein the selecting means selects the path to which the substrate is transferred to so that the substrate is transferred in the order of the first coating apparatus, the first heating apparatus, the second coating apparatus, the second heating apparatus, the first coating apparatus and the first heating apparatus.
5 . The film forming apparatus as set forth in claim 1 , wherein the selecting means selects the path to which the substrate is transferred to so that the substrate is transferred in the order of the first coating apparatus, the second heating apparatus, the first heating apparatus, the second coating apparatus, the second heating apparatus, the first coating apparatus, the second heating apparatus and the first heating apparatus.
6 . The apparatus as set forth in claim 1 , wherein the first heating apparatus comprises:
a plate on which the substrate is placed; and cooling means for cooling the plate.
7 . (canceled)
8 . The method as set forth in claim 7 , wherein step (d) is further followed by the steps in the order of step (a) and step (b) the
9 . (canceled)
10 . (canceled)
11 . (canceled)
12 . An apparatus for forming a film on a substrate, comprising:
a first coating apparatus coating a porous insulation film material on the substrate with a spin coat process; a first heating apparatus heating the substrate on which the porous insulation material is coated so as to form a first insulation film thereon; a second coating apparatus coating a non-porous insulation film material on the substrate with the spin coat process; a second heating apparatus heating the substrate on which the non-porous insulation material is coated so as to form a second insulation film thereon; and a transferring mechanism transferring the substrate among the first coating apparatus, the second coating apparatus, the first heating apparatus and the second heating apparatus.
13 . The apparatus as set forth in claim 12 , further comprising:
a reforming apparatus reforming a front surface of the first insulation film, wherein the transferring mechanism transfers the substrate to the reforming apparatus.Join the waitlist — get patent alerts
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