Bump style MEMS switch

Abstract

A microelectromechanical system switch may be formed with a protrusion defined on the substrate which makes contact with a deflectable member arranged over the substrate. The deflectable member may, for example, be a cantilevered arm or a deflectable beam. The protrusion may be formed in the substrate in one embodiment using field oxide techniques.

1 - 9 . (canceled)  
   
   
       10 . A microelectromechanical system comprising: 
 a substrate;    a deflectable member formed on said substrate so as to move towards and away from said substrate; and    a contact formed on said substrate protruding toward said deflectable member a portion of said contact being formed of an insulator.    
   
   
       11 . The switch of  claim 10 , said contact including a protrusion including an said insulator covered by a conductive layer.  
   
   
       12 . The switch of  claim 11  wherein said insulator is field oxide.  
   
   
       13 . The switch of  claim 10  wherein said deflectable member is a cantilevered beam.  
   
   
       14 . The switch of  claim 10  wherein said deflectable member has a lower surface which is substantially planar and substantially free of downwardly directed protrusions.  
   
   
       15 - 20 . (canceled)  
   
   
       21 . The switch of  claim 11  wherein said oxide extends into said substrate.  
   
   
       22 . The switch of  claim 13  wherein said member has a free end and a fixed end, said fixed end arranged to contact said contact on said substrate.