Cooling apparatus and method for manufacturing the same
Abstract
A cooling apparatus for dissipating heat from an electronic component, includes a body and two lids. The body is integrally formed by extruding a claviform aluminum stuff and includes a hollow tube with two open ends on opposite ends thereof and a plurality of fins integrally extending from the periphery of the tube. The two lids respectively seal the two open ends of the tube and form a chamber in the body. A wicking structure is installed on the inner peripheral surface of the tube. Heat-conductive evaporable working medium is contained in the chamber for transmitting heat absorbed by one of the lids contacting with the electronic component.
Claims
exact text as granted — not AI-modified1 . A cooling apparatus for dissipating heat from an electronic component, comprising:
a body comprising a hollow tube with two open ends on opposite ends thereof and a plurality of fins integrally extending from a periphery of the tube; and two lids respectively sealing the two open ends of the tube thereby forming a closed chamber in the body, a wicking structure installed on the inner circumferential surface of the tube, and working medium contained in the chamber for transmitting heat absorbed by one of the lids contacting with the electronic component.
2 . The cooling apparatus as described in claim 1 , wherein the fins extend radially and outwardly from the periphery of the tube along an axis of the tube.
3 . The cooling apparatus as described in claim 1 , wherein the body is integrally formed by extruding a claviform aluminum stuff.
4 . The cooling apparatus as described in claim 1 , wherein the chamber is substantially vacuum.
5 . The cooling apparatus as described in claim 1 , wherein the working medium is capable of evaporating when absorbing the heat generated by the electronic component and condensing after releasing the heat to the fins.
6 . The cooling apparatus as described in claim 1 , wherein the two lids are detachably attached to the two open ends of the tube.
7 . A method for manufacturing a cooling apparatus, comprising the steps of:
(a) providing a metal stuff; (b) extruding the stuff to integrally form a plurality of fins extending outwardly and radially from a column, the column comprising at least one tube with two open ends; (c) installing a wicking structure on the inner circumferential surface of the tube; (d) providing a lid to seal one end of the tube to form a chamber; (e) supplying working medium in the chamber; and (f) providing another lid to seal the other end of the tube and vacuumizing the chamber.
8 . The method as describe in claim 7 , further comprising a step of cutting the column after step (b) to form a plurality of tubes.
9 . The method as describe in claim 7 , wherein the working medium is capable of evaporating when absorbing heat and condensing after releasing heat.
10 . The method as describe in claim 7 , wherein the fins extend radially and outwardly from the periphery of the tube along an axis of the tube.
11 . A cooling apparatus for dissipating heat from an electronic component, comprising:
a body comprising a hollow tube with at least two ends open to communicate with outside of said body, one of said at least two ends movably facing said electronic component, a plurality of fins integrally extending from a periphery of said tube, and a wicking structure installed on an inner circumferential surface of said tube; a working medium fluently received in said tube; and a lid installed at each of said at least two ends of said tube and detachably sealing said each end, said one of said at least two ends facing said electronic component usable to allow said sealing lid thereof to heat-conductively engage with said electronic component and transmit said heat from said electronic component to said working medium.
12 . The cooling apparatus as described in claim 11 , wherein said sealing lid of said one of said at least two ends is circular.Join the waitlist — get patent alerts
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