Copper alloy

Abstract

A copper alloy for electronic machinery and tools, containing Ni 2.0 to 4.5 mass %, and Si 0.3 to 1.0 mass %, with the balance being Cu and unavoidable impurities, which satisfies the following expression: I {311 }×A /( I {311}+ I {220}+ I {200})<1.5 wherein I{311} represents an X-ray diffraction intensity from a {311} plane at a sheet surface; I{220} represents an X-ray diffraction intensity from a {220} plane at the sheet surface; I{200} represents an X-ray diffraction intensity from a {200} plane at the sheet surface; and A (μm) represents a crystalline grain size, and which has good bending property.

1 . A copper alloy for electronic machinery and tools, comprising Ni 2.0 to 4.5 mass %, and Si 0.3 to 1.0 mass %, with the balance being Cu and unavoidable impurities, 
 which satisfies expression (1):        I {311 }×A /( I {311 }+I {220 }+I{ 200})<1.5  (1)    wherein, in expression (1), I{311} represents an X-ray diffraction intensity from a {311} plane at a sheet surface; I{220} represents an X-ray diffraction intensity from a {220} plane at the sheet surface; I{200} represents an X-ray diffraction intensity from a {200} plane at the sheet surface; and A (μm) represents a crystalline grain size, and    which has good bending property.    
   
   
       2 . The copper alloy according to  claim 1 , which further comprises at least one element selected from the group consisting of Zn 0.2 to 1.5 mass %, Mg 0.01 to 0.2 mass %, and Sn 0.05 to 1.5 mass %.  
   
   
       3 . The copper alloy according to  claim 1 , which further comprises at least one element selected from the group consisting of Zr 0.005 to 0.3 mass %, Co 0.05 to 2.0 mass %, and B 0.001 to 0.02 mass %, in a total content of 0.001 to 2.0 mass %.  
   
   
       4 . A copper alloy for electronic machinery and tools, comprising Ni 2.0 to 4.5 mass %, Si 0.3 to 1.0 mass %, and S more than 0 and less than 0.005 mass %, with the balance being Cu and unavoidable impurities, 
 which satisfies expression (1):        I{ 311 }×A /( I{ 311 }+I{ 220 }+I{ 200})<1.5  (1)    wherein, in expression (1), I{311} represents an X-ray diffraction intensity from a {311} plane at a sheet surface; I{220} represents an X-ray diffraction intensity from a {220} plane at the sheet surface; I{200} represents an X-ray diffraction intensity from a {200} plane at the sheet surface; and A (μm) represents a crystalline grain size, and    which has good bending property.    
   
   
       5 . The copper alloy according to  claim 4 , which further comprises at least one element selected from the group consisting of Zn 0.2 to 1.5 mass %, Mg 0.01 to 0.2 mass %, and Sn 0.05 to 1.5 mass %.  
   
   
       6 . The copper alloy according to  claim 4 , which further comprises at least one element selected from the group consisting of Zr 0.005 to 0.3 mass %, Co 0.05 to 2.0 mass %, and B 0.001 to 0.02 mass %, in a total content of 0.001 to 2.0 mass %.  
   
   
       7 . A copper alloy for electronic machinery and tools, comprising Ni 2.0 to 4.5 mass %, Si 0.3 to 1.0 mass %, Mg 0.01 to 0.2 mass %, Sn 0.05 to 1.5 mass %, Zn 0.2 to 1.5 mass %, and S less than 0.005 mass %, with the balance being Cu and unavoidable impurities, 
 which satisfies expression (1):        I{ 311 }×A /( I{ 311 }+I{ 220 }+I{ 200})<1.5  (1)    wherein, in expression (1), I{311} represents an X-ray diffraction intensity from a {311} plane at a sheet surface; I{220} represents an X-ray diffraction intensity from a {220} plane at the sheet surface; I{200} represents an X-ray diffraction intensity from a {200} plane at the sheet surface; and A (μm) represents a crystalline grain size, and    which has good bending property.    
   
   
       8 . The copper alloy according to  claim 7 , which further comprises at least one element selected from the group consisting of Zr 0.005 to 0.3 mass %, Co 0.05 to 2.0 mass %, and B 0.001 to 0.02 mass %, in a total content of 0.001 to 2.0 mass %.  
   
   
       9 . A copper alloy, comprising Ni 2.0 to 4.5 mass %, Si 0.3 to 1.0 mass %, Cr 0.1 to 0.5 mass %, and S less than 0.005 mass %, with the balance being Cu and unavoidable impurities, 
 which satisfies expression (2):        I{ 311}/( I{ 311 }+I{ 220 }+I{ 200})<0.15  (2)    wherein, in expression (2), I{311} represents an X-ray diffraction intensity from a {311} plane at a sheet surface; I{220} represents an X-ray diffraction intensity from a {220} plane at the sheet surface; and I{200} represents an X-ray diffraction intensity from a {200} plane at the sheet surface.    
   
   
       10 . The copper alloy according to  claim 9 , which further comprises at least one element selected from the group consisting of Zn 0.2 to 1.5 mass %, Mg 0.01 to 0.2 mass %, and Sn 0.05 to 1.5 mass %.  
   
   
       11 . The copper alloy according to  claim 9 , which further comprises at least one element selected from the group consisting of Zr 0.005 to 0.3 mass %, Co 0.05 to 2.0 mass %, Ti 0.005 to 0.3 mass %, Ag 0.005 to 0.3 mass %, and B 0.001 to 0.02 mass %.  
   
   
       12 . A copper alloy, comprising Ni 2.0 to 4.5 mass %, Si 0.3 to 1.0 mass %, Cr 0.1 to 0.5 mass %, and S less than 0.005 mass %, with the balance being Cu and unavoidable impurities, 
 which satisfies expression (3):        I{ 311 }×A /( I{ 311 }+I{ 220 }+I{ 200})<1.5  (3)    wherein, in expression (3), I{311} represents an X-ray diffraction intensity from a {311} plane at a sheet surface; I{220} represents an X-ray diffraction intensity from a {220} plane at the sheet surface; I{200} represents an X-ray diffraction intensity from a {200} plane at the sheet surface; and A (μm) represents a crystalline grain size.    
   
   
       13 . The copper alloy according to  claim 12 , which further comprises at least one element selected from the group consisting of Zn 0.2 to 1.5 mass %, Mg 0.01 to 0.2 mass %, and Sn 0.05 to 1.5 mass %.  
   
   
       14 . The copper alloy according to  claim 12 , which further comprises at least one element selected from the group consisting of Zr 0.005 to 0.3 mass %, Co 0.05 to 2.0 mass %, Ti 0.005 to 0.3 mass %, Ag 0.005 to 0.3 mass %, and B 0.001 to 0.02 mass %.