US2005262809A1PendingUtilityA1
Method for producing package
Assignee: MATSUSHITA ELECTRIC INDUSTRIAL CO LTDPriority: May 27, 2004Filed: May 27, 2005Published: Dec 1, 2005
Est. expiryMay 27, 2024(expired)· nominal 20-yr term from priority
B65B 11/50B65D 2575/363B65D 2585/88
43
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Claims
Abstract
The present invention provides a package realizing a simpler structure, simpler production process, lower product cost, lower production cost, higher strength and excellent appearance. The package is produced by successively forming, on a first surface of a light permeable base, a first printing layer, an anti-offset layer and a second printing layer in a single printing step to give a backing sheet, and allowing the backing sheet to hold an article at the side of a second surface of the base.
Claims
exact text as granted — not AI-modified1 . A method for producing a package comprising the steps of:
(1) successively forming, onto a first surface of a light permeable base, a first printing layer, an anti-offset layer and a second printing layer by a single printing step to give a backing sheet; and (2) allowing said backing sheet to hold an article at the side of a second surface of said base.
2 . The method for producing a package in accordance with claim 1 , wherein, in said step (2), a container accommodating said article is integrated with said second surface to allow said backing sheet to hold said article.
3 . The method for producing a package in accordance with claim 2 , wherein said container is bonded to said second surface by heat sealing.Join the waitlist — get patent alerts
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