Chemical mechanical polishing pad and chemical mechanical polishing method

Abstract

A chemical mechanical polishing pad having a polishing surface, a non-polishing surface opposite to the polishing surface and a side surface for defining these surfaces, the polishing surface having (i) a first group of grooves which intersect a single virtual straight line extending from the center toward the peripheral portion of the polishing surface and do not cross one another, or a single first spiral groove which expands gradually from the center portion toward the peripheral portion of the polishing surface, and (ii) a second group of grooves which extend from the center portion toward the peripheral portion of the polishing surface, intersect the first group of grooves or the first spiral groove and do not cross one another. Since this chemical mechanical polishing pad fully suppresses the occurrence of a scratch on the polished surface and has an excellent polishing rate, it is advantageously used in a chemical mechanical polishing method.

1 . A chemical mechanical polishing pad having a polishing surface, a non-polishing surface opposite to the polishing surface and a side surface for defining these surfaces, the polishing surface having at least two groups of grooves,  
       wherein 
 the two groups of grooves consist of (i) a first group of grooves which intersect a single virtual straight line extending from the center portion toward the peripheral portion of the polishing surface and do not cross one another and (ii) a second group of grooves which extend from the center portion toward the peripheral portion of the polishing surface, intersect the first group of grooves and do not cross one another.  
 
     
     
         2 . The pad according to  claim 1  which is shaped like a disk and has a circular top surface and a circular bottom surface as the polishing surface and the non-polishing surface, respectively.  
     
     
         3 . The pad according to  claim 1 , wherein the first group of grooves consists of a plurality of grooves which are arranged concentrically and differ from one another in diameter, or a plurality of spiral grooves on the polishing surface.  
     
     
         4 . The pad according to  claim 3 , wherein the number of grooves which are arranged concentrically and differ from one another in diameter is 20 to 400.  
     
     
         5 . The pad according to  claim 3 , wherein the number of spiral grooves is 2 to 10.  
     
     
         6 . The pad according to  claim 1 , wherein the grooves of the first group have a width of 0.1 mm or more and a depth of 0.1 mm or more and the shortest distance between intersections between the grooves of the first group and the virtual straight line is 0.05 mm or more.  
     
     
         7 . The pad according to  claim 1 , wherein the second group of grooves consists of a plurality of linear grooves extending from the center portion toward the peripheral portion of the pad and at least one of them reaches the side surface of the pad.  
     
     
         8 . The pad according to  claim 1 , wherein the second group of grooves consists of a plurality of linear grooves extending from the center portion toward the peripheral portion of the pad and a plurality of linear grooves extending from a halfway portion between the center portion and the peripheral portion toward the peripheral portion and at least one of them reaches the side surface of the pad.  
     
     
         9 . The pad according to  claim 7  or  8 , wherein the second group of grooves includes paired parallel linear grooves.  
     
     
         10 . The pad according to  claim 7  or  8 , wherein the second group of grooves consists of 4 to 65 linear grooves.  
     
     
         11 . The pad according to  claim 7 , wherein the grooves of the second group have a width of 0.1 mm or more and a depth of 0.1 mm or more.  
     
     
         12 . A chemical mechanical polishing method making use of the chemical mechanical polishing pad of  claim 1 .  
     
     
         13 . A chemical mechanical polishing pad having a polishing surface, a non-polishing surface opposite to the polishing surface and a side surface for defining these surfaces, the polishing surface having at least two groups of grooves, wherein 
 the two groups of grooves consist of (i) a single first spiral groove which expands gradually from the center portion toward the peripheral portion of the polishing surface and (ii) a second group of grooves which extend from the center portion toward the peripheral portion of the polishing surface, intersect the spiral groove and do not cross one anther.    
     
     
         14 . The pad according to  claim 13  which is shaped like a disk and has a circular top surface and a circular bottom surface as the polishing surface and the non-polishing surface, respectively.  
     
     
         15 . The pad according to,  claim 13 , wherein the number of turns of the spiral groove is 20 to 400.  
     
     
         16 . The pad according to  claim 13 , wherein the first spiral groove has a width of 0.1 mm or more and a depth of 0.1 mm or more, and the shortest distance between intersections between the first spiral groove and a single virtual straight line extending from the center portion to the peripheral portion of the polishing surface is 0.05 mm or more.  
     
     
         17 . The pad according to  claim 13 , wherein the second group of grooves consists of a plurality of linear grooves extending from the center portion toward the peripheral portion and at least one of them reaches the side surface of the pad.  
     
     
         18 . The pad according to  claim 13 , wherein the second group of grooves consist of a plurality of linear grooves extending from the center portion toward the peripheral portion and a plurality of linear grooves extending from a halfway portion between the center portion and the peripheral portion toward the peripheral portion and at least one of them reaches the side surface of the pad.  
     
     
         19 . The pad according to  claim 17  or  18 , wherein the second group of grooves includes paired parallel linear grooves.  
     
     
         20 . The pad according to  claim 17  or  18 , wherein the second group of grooves consists of 4 to 65 linear grooves.  
     
     
         21 . The pad according to  claim 17 , wherein the grooves of the second group have a width of 0.1 mm or more and a depth of 0.1 mm or more.  
     
     
         22 . A chemical mechanical polishing method making use of the chemical mechanical polishing pad of  claim 13.