Package modification for channel-routed circuit boards

Abstract

A method for implementing a circuit component on a surface of a multilayer circuit board is provided. The circuit component includes a plurality of pins and the circuit board includes a plurality of electrically conductive vias penetrating at least one layer of the circuit board and being arranged so as to form at least one channel for routing one or more traces at one or more signal layers of the circuit board. The method comprises the step of forming at least one pin of the plurality of pins of the circuit component to have a length compatible with a depth of a corresponding via of the circuit board.

1 - 14 . (canceled)  
   
   
       15 . A circuit device comprising: 
 a multilayer circuit board having a plurality of layers and a plurality of electrically conductive vias extending from a surface of the multilayer circuit board through one or more of the plurality of layers, the plurality of electrically conductive vias comprising blind vias of differing depths extending from the surface of the multilayer circuit board through respective subsets of the plurality of layers and arranged so as to form at least one channel for routing one or more traces at one or more signal layers of the multilayer circuit board beneath the blind vias; and    a circuit component mounted to the surface of the multilayer circuit board having a plurality of pins corresponding to at least a portion of the plurality of electrically conductive vias, each pin having a length that is formed to coincide with a respective depth of a corresponding electrically conductive via and to provide electrical contact therewith.    
   
   
       16 . The circuit device of  claim 15 , wherein the plurality of pins includes one or more pins trimmed to lengths no greater than the depths of the corresponding electrically conductive vias.  
   
   
       17 . The circuit device of  claim 15 , wherein the plurality of pins includes one or more pins manufactured having lengths no greater than the depths of the corresponding electrically conductive vias.  
   
   
       18 . The circuit device of  claim 15 , wherein each of the plurality of pins includes one of the group consisting of: a straight pin, a metal dendrite, a column, and a ball.  
   
   
       19 . The circuit device of  claim 15 , wherein the plurality of pins includes a combination of the group consisting of: a straight pin, a metal dendrite, a column, and a ball.  
   
   
       20 . A circuit device comprising: 
 a multilayer circuit board having a plurality of layers and a plurality of electrically conductive vias extending from a surface of the multilayer circuit board through one or more of the plurality of layers, the plurality of electrically conductive vias comprising blind vias of differing depths extending from the surface of the multilayer circuit board through respective subsets of the plurality of layers and arranged so as to form at least one channel for routing one or more traces at one or more signal layers of the multilayer circuit board beneath the blind vias; and    a circuit component having a plurality of pins corresponding to at least a portion of the plurality of electrically conductive vias, each pin having a length that is formed to coincide with a respective depth of a corresponding electrically conductive via and to provide electrical contact therewith when mounted to the surface of the multilayer circuit board.    
   
   
       21 . The circuit device of  claim 20 , wherein one or more of the plurality of pins are trimmed to lengths no greater than the depths of the corresponding electrically conductive vias.  
   
   
       22 . The circuit device of  claim 20 , wherein one or more of the plurality of pins are manufactured having lengths no greater than the depths of the corresponding electrically conductive vias.  
   
   
       23 . The circuit device of  claim 20 , wherein each of the plurality of pins includes one of the group consisting of: a straight pin, a metal dendrite, a column, and a ball.  
   
   
       24 . The circuit device of  claim 20 , wherein the plurality of pins includes a combination of the group consisting of: a straight pin, a metal dendrite, a column, and a ball.  
   
   
       25 . A circuit device comprising: 
 a multilayer circuit board having a plurality of layers and a plurality of electrically conductive vias extending from a surface of the multilayer circuit board through one or more of the plurality of layers, the plurality of electrically conductive vias comprising blind vias of differing depths extending from the surface of the multilayer circuit board through respective subsets of the plurality of layers and arranged so as to form at least one channel for routing one or more traces at one or more signal layers of the multilayer circuit board beneath the blind vias, such that a circuit component having a plurality of pins corresponding to at least a portion of the plurality of electrically conductive vias, wherein each pin has a length that is formed to coincide with a respective depth of a corresponding electrically conductive via, may be mounted to the surface of the multilayer circuit board so as to provide electrical contact between each pin and a corresponding electrically conductive via.