US2005257914A1PendingUtilityA1

Skived-fin annular heat sink

Assignee: HUANG LIANG-FUPriority: May 7, 2004Filed: May 5, 2005Published: Nov 24, 2005
Est. expiryMay 7, 2024(expired)· nominal 20-yr term from priority
Inventors:Liang Huang
H10W 40/226F28F 1/16
35
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A skived-fin annular heat sink is manufactured via a skived-fin technology and includes at least one bottom board and a plurality of fins. The at least one bottom board is bended to form a closed-shaped. The fins are extended outwardly from the at least one bottom board, wherein each of the fins has a bending portion for connecting the fin with the bottom board. Hence the skived-fin annular heat sink can be adapted to a chip of PCB with over limited space, and can used to increase the number of fins for increasing the heat-dissipating area between the chip and the heat sink.

Claims

exact text as granted — not AI-modified
1 . A skived-fin annular heat sink manufactured via a skived-fin technology, comprising: 
 at least one bottom board bended to form a closed-shaped; and    a plurality of fins extended outwardly from the at least one bottom board, wherein each of the fins has a bending portion for connecting the fin with the bottom board.    
   
   
       2 . The skived-fin annular heat sink as claimed in  claim 1 , wherein the bottom board and the fins are made of copper or copper alloy materials.  
   
   
       3 . The skived-fin annular heat sink as claimed in  claim 1 , wherein the bottom board and the fins are made of aluminum material and aluminum alloy materials.  
   
   
       4 . The skived-fin annular heat sink as claimed in  claim 1 , wherein the closed-shaped bottom board is formed via two semicircular bottom board or a plurality of fan-shaped bottom board assembled together.  
   
   
       5 . The skived-fin annular heat sink as claimed in  claim 4 , further comprising at least one connecting component for connecting every two adjacent semicircular bottom boards or fan-shaped bottom board.  
   
   
       6 . The skived-fin annular heat sink as claimed in  claim 1 , wherein the at least one bottom board is bended to form the closed-shaped via a welding.  
   
   
       7 . The skived-fin annular heat sink as claimed in  claim 1 , wherein the bottom board is an erect closed cylinder.  
   
   
       8 . The skived-fin annular heat sink as claimed in  claim 1 , wherein the bottom board is an erect closed rectangle.  
   
   
       9 . The skived-fin annular heat sink as claimed in  claim 1 , wherein the fins are arranged to form a rectangular or trapezoid shape.  
   
   
       10 . The skived-fin annular heat sink as claimed in  claim 1 , further comprising a heat-conducting block disposed in a center portion of the bottom board.  
   
   
       11 . The skived-fin annular heat sink as claimed in  claim 10 , wherein the heat-conducting block has a trapezoid-shaped cross-sectional.  
   
   
       12 . The skived-fin annular heat sink as claimed in  claim 1 , wherein the fins are arranged obliquely on the bottom board, and each of the fins has an upward and oblique angle formed on a bottom side thereof.  
   
   
       13 . The skived-fin annular heat sink as claimed in  claim 1 , wherein the fins are arranged spirally on the bottom board.

Join the waitlist — get patent alerts

Track US2005257914A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.