Heat sink with fins fitted and bonded thereto by applying conductive glue

Abstract

Disclosed is a heat sink used for telecommunication equipment, a high power amplifier or a CPU of a computer in order to emit heat having a high temperature to an exterior for properly maintaining operational characteristics of equipment. Instead of fabricating the heat sink through an extruding process by using a mold, in which molten metal is extruded from the mold by applying high pressure to the mold, fins are separately fabricated so as to obtain a maximum surface area per a unit area of the heat sink, thereby allowing the heat sink to emit a great amount of heat. The mold used for fabricating the fins of the heat sink has narrow and elongated slots, so manufacturing costs and a manufacturing period for the mold are increased. The mold is also easily broken and eroded. To solve the above problem, the disclosed heat sink includes a base made from aluminum and a plurality of fins made from laminated aluminum and press-fitted into the base. A conductive glue is applied to lower tips of the fins and the fins are fixedly press-fitted into fitting slots of the base by using a press.

1 . A heat sink comprising: 
 a base formed with fitting slots;    a plurality of fins press-fitted into the fitting slots; and    a conductive glue consisting of aluminum powder and a curing agent applied to lower tips of the fins for allowing the fins to be fixedly inserted into the fitting slots.    
   
   
       2 . The heat sink as claimed in  claim 1 , wherein the fins are made from laminated aluminum and the base is made from an aluminum plat.  
   
   
       3 . The heat sink as claimed in  claim 1 , wherein the base and the fins are integrally formed with each other without forming a gap which acts as an insulation layer.  
   
   
       4 . The heat sink as claimed in  claim 1 , wherein the heat sink is used for a high power amplifier or a CPU of a computer for emitting heat having a high temperature to an exterior.