US2005257912A1PendingUtilityA1

Laser cooling system and method

Assignee: LITELASER LLCPriority: Jan 12, 2004Filed: Jan 12, 2005Published: Nov 24, 2005
Est. expiryJan 12, 2024(expired)· nominal 20-yr term from priority
F28F 3/025H01S 3/0405H01S 3/0404H01S 3/0407
43
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A folded sheet is used as a basis for a fin array to cool laser modules. The folded sheet has flat portions that are connected in thermal contact with the laser module, and fins formed by interconnecting portions. This arrangement is highly convenient for assembly, inexpensive, and provides for highly effective heat exchange.

Claims

exact text as granted — not AI-modified
1 .) A laser system comprising: 
 a laser module having a cooling face; and    a heat exchange element constructed as at least one folded sheet of thermally conductive material comprising a plurality of flat portions connected in thermal contact with the cooling face, and a plurality of interconnecting portions extending between the flat portions and away from the cooling face to form cooling fins.    
   
   
       2 .) The system of  claim 1 , wherein the cooling fins extend in a plurality of strips arranged alongside each other such that the cooling fins in adjacent ones of the strips are offset from one another.  
   
   
       3 .) The system of  claim 1 , wherein the flat portions are connected to the cooling face with a bond.  
   
   
       4 .) The system of  claim 3 , wherein the bond comprises a thermally conductive adhesive.  
   
   
       5 .) The system of  claim 3 , wherein the bond comprises a brazing solder.  
   
   
       6 .) The system of  claim 1 , wherein the flat portions are connected to the cooling face with fasteners.  
   
   
       7 .) The system of  claim 1 , wherein the interconnecting portions are apertured.  
   
   
       8 .) A method of assembling a laser package, comprising: 
 providing a laser module having a cooling face;    providing a folded sheet of thermally conductive material comprising a plurality of flat portions arrangeable on a common plane and a plurality of interconnecting portions extending between the flat portions and away from the common plane to form fins; and    bonding the flat portions of the folded sheet to the cooling face so that the folded sheet forms a heat exchange element for the laser module with the interconnecting portions extending away from the cooling face to form cooling fins.    
   
   
       9 .) The method of  claim 8 , wherein said bonding comprises placing a thermally conductive adhesive between the cooling face and the flat portions of the folded sheet.  
   
   
       10 .) The method of  claim 8 , wherein said bonding comprises placing a brazing solder between the cooling face and the flat portions of the folded sheet at an elevated temperature.  
   
   
       11 .) The method of  claim 8 , wherein the folded sheet is extensible and compressible by its interconnecting portions, and wherein prior to said bonding the folded sheet is extended or compressed by a desired amount and then bonded to the cooling face in its extended or compressed state.  
   
   
       12 .) The method of  claim 11 , wherein the folded sheet is extended or compressed by different amounts along different sections thereof so that the flat portions are separated by different amounts in the different sections.

Join the waitlist — get patent alerts

Track US2005257912A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.