Probe cleaning sheet and cleaning method

Abstract

A probe cleaning sheet is provided, which can be used not only at a room temperature and high temperature but also in a low temperature environment with sufficient cushioning property and which can softly and efficiently clean a probe tip end. Specifically, the cleaning sheet has a layered structure including an elastic layer below a polishing layer, for removing, by contact with the polishing layer, foreign matter adhered on a tip end of a probe for semiconductor inspection, and the elastic layer is a polytetrafluoro-ethylene porous body layer.

1 . A probe cleaning sheet having a layered structure including an elastic layer below a polishing layer, for removing, by contact with the polishing layer, foreign matter adhered on a tip end of a probe for semiconductor inspection, wherein 
 the elastic layer is a polytetrafluoro-ethylene porous body layer.    
   
   
       2 . The probe cleaning sheet according to  claim 1 , wherein 
 the polytetrafluoro-ethylene porous body layer has porosity of 30 to 90% and average pore diameter of 0.01 to 1 μm.    
   
   
       3 . The probe cleaning sheet according to  claim 1 , wherein 
 the polishing layer is a resin composition layer containing fine abrasive powder having grain diameter of 0.05 to 5 μm dispersed in resin.    
   
   
       4 . The probe cleaning sheet according to  claim 3 , wherein 
 the fine abrasive powder is at least one inorganic fine powder selected from the group consisting of aluminum oxide, silicon nitride, boron nitride, silicon carbide, boron carbide and diamond.    
   
   
       5 . The probe cleaning sheet according to  claim 3 , wherein 
 the resin forming the resin composition layer having fine abrasive powder dispersed is fluoro-plastic, epoxy resin, urethane resin or enamel resin.    
   
   
       6 . The probe cleaning sheet according to  claim 1 , wherein 
 the layered structure further includes an adhesive layer arranged directly below the polytetrafluoro-ethylene porous body layer or with a synthetic resin film layer interposed therebetween.    
   
   
       7 . The probe cleaning sheet according to  claim 6 , wherein 
 the adhesive layer is a semi-cured layer of applied adhesive.    
   
   
       8 . The probe cleaning sheet according to  claim 6 , wherein 
 the layered structure further includes releasing paper arranged below the adhesive layer.    
   
   
       9 . The probe cleaning sheet according to  claim 6 , wherein 
 the layered structure further includes a substrate adhered to the adhesive layer, below the adhesive layer.    
   
   
       10 . A method of cleaning for removing foreign matter adhered on a tip end of a probe for semiconductor inspection using the probe cleaning sheet according to  claim 1  in a low temperature environment of 0° C. or lower.