Thermal protrusion reduction in magnet heads by utilizing heat sink layers

Abstract

A magnetic read/write head and slider assembly and method for forming said magnetic read/write head and slider assembly, wherein said assembly has improved heat spreading and dissipation properties and exhibits significantly reduced thermal protrusion during operation. The method consists of the formation of a heat sink layer on a portion of either the upper pole yoke or the lower magnetic pole of the writer.

1 - 10 . (canceled)  
   
   
       11 . A method for fabricating a magnetic read/write head and slider assembly having improved heat spreading and heat dissipation characteristics and reduced thermal protrusion comprising: 
 providing a read/write head and slider assembly wherein the write element portion of said read/write head comprises at least a lower magnetic pole piece, an upper pole tip and yoke assembly and an inductive coil positioned between said pole piece and yoke;    forming a heat sink layer in thermal contact with a portion of a surface of the lower magnetic pole piece;    forming an insulating overcoat over the assembly.    
   
   
       12 . The method of  claim 11  wherein the heat sink layer covers a portion of the upper surface of the lower magnetic pole piece and extends laterally beneath a substantial portion of the inductive coil.  
   
   
       13 . The method of  claim 11  wherein the heat sink layer covers a portion of the lower surface of the lower magnetic pole piece and extends laterally beneath a substantial portion of the inductive coil.  
   
   
       14 . The method of  claim 11  wherein the material of which the heat sink layer is formed is a material having thermal conductivity which is higher than that of surrounding and contiguous materials.  
   
   
       15 . The method of  claim 14  wherein the material of which the heat sink layer is formed is selected from the group consisting of electrically conducting materials and magnetic materials.  
   
   
       16 . The method of  claim 15  wherein the material of which the heat sink layer is formed is selected from the group of materials with high thermal conductivities consisting of Cu, Au, Ag, Ni, Al, Ta, W, alloys thereof and combinations thereof.  
   
   
       17 . The method of  claim 11  wherein the heat sink layer is a double layer, comprising a first layer which is an electrically insulating spacer layer and a second layer selected from the group of electrically conducting and magnetic materials and wherein the electrically insulating layer is in contact with the upper surface of the yoke.  
   
   
       18 . The method of  claim 17  wherein the second layer is a layer of Cu formed to a thickness of between approximately 0.25 and 10 microns.  
   
   
       19 . The method of  claim 17  wherein the first layer is a layer of alumina formed to a thickness of between approximately 0 and 10 microns.  
   
   
       20 . The method of  claim 11  wherein the overcoat layer is a layer of alumina.  
   
   
       21 - 30 . (canceled)  
   
   
       31 . A magnetic read/write head and slider assembly having improved heat spreading and heat dissipation characteristics and reduced thermal protrusion comprising: 
 a read/write head and slider assembly wherein the write element portion of said read/write head comprises at least a lower magnetic pole piece, an upper pole tip and yoke assembly and an inductive coil positioned between said lower magnetic pole piece and yoke;    a heat sink layer formed on a surface of the lower magnetic pole piece; and    an insulating overcoat encapsulating the assembly.    
   
   
       32 . The assembly of  claim 31  wherein the heat sink layer covers a portion of the upper surface of the lower magnetic pole piece and extends laterally beneath a substantial portion of the inductive coil.  
   
   
       33 . The assembly of  claim 31  wherein the heat sink layer covers a portion of the lower surface of the lower magnetic pole piece and extends laterally beneath a substantial portion of the inductive coil.  
   
   
       34 . The assembly of  claim 31  wherein the material of which the heat sink layer is formed is a material having thermal conductivity which is higher than that of surrounding and contiguous materials.  
   
   
       35 . The assembly of  claim 34  wherein the material of which the heat sink layer is formed is selected from the group consisting of electrically conducting materials and magnetic materials.  
   
   
       36 . The assembly of  claim 34  wherein the material of which the heat sink layer is formed is selected from the group of materials with high thermal conductivities consisting of Cu, Au, Ag, Ni, Al, Ta, W, alloys thereof and combinations thereof.  
   
   
       37 . The assembly of  claim 34  wherein the heat sink layer is a double layer, comprising a first layer which is an electrically insulating spacer layer and a second layer selected from the group of electrically conducting and magnetic materials and wherein the electrically insulating layer is in contact with the upper surface of the yoke.  
   
   
       38 . The assembly of  claim 37  wherein the second layer is a layer of Cu formed to a thickness of between approximately 0.25 and 10 microns.  
   
   
       39 . The assembly of  claim 37  wherein the first layer is a layer of alumina formed to a thickness of between approximately 0 and 10 microns.