US2005253611A1PendingUtilityA1

Probe apparatus

Assignee: TOKYO ELECTRON LTDPriority: Aug 23, 2002Filed: Jul 5, 2005Published: Nov 17, 2005
Est. expiryAug 23, 2022(expired)· nominal 20-yr term from priority
H10P 74/00G01R 31/2891G01R 31/2887G01R 31/2806
48
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Claims

Abstract

A probe apparatus includes a mounting member on which an object to be inspected is mounted and a temperature thereof is being adjusted, a probe card arranged opposite to the mounting member, a driving mechanism which changes a relative positional relationship between the mounting member and the probe card, and a sensor which detects the distance between the sensor and the probe card. By way of detecting the height of the deformed probe card through the use of the sensor and revising the elevation distance of the mounting member, the electrode pads of the wafer W and the probe pins can electrically contact each other with a stable pin pressure, providing high inspection reliability and an increase in throughput.

Claims

exact text as granted — not AI-modified
1 - 12 . (canceled)  
   
   
       13 . A probing method for use with a probe apparatus, wherein the probe apparatus includes a mounting member for mounting thereon an object to be inspected, a probe card provided with a plurality of probe pins and a driving mechanism which changes a relative positional relationship between the mounting member and the probe card, the probing method comprising the step of: 
 detecting a displacement of a region of the probe card where the probe pins are located with respect to the position of a part of the apparatus to which the probe card is fixed.    
   
   
       14 . The probing method of  claim 13 , wherein the detecting step includes the step of sensing the displacement from a measuring point at a back surface of the probe card, the back surface located opposite a main surface of the probe card where the probe pins are provided.  
   
   
       15 . The probing method of  claim 14 , wherein the measuring point corresponds to a center of the probe pins.  
   
   
       16 . The probing method of  claim 14 , wherein the sensing step includes the steps of: 
 transmitting a laser beam toward the measuring point; and    receiving a laser beam reflected from the measuring point,    wherein the transmitting and receiving steps are carried out at two separate locations corresponding to two opposite sides of the probe card.

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