Method for assembling and brazing CPU heat sink modules

Abstract

A method of brazing components of a heat sink module is described. The method may include the steps of assembling the components to be brazed, and placing a copper-silver alloy filler at junctions between the components. The assembled components may be pre-heated in an air-tight environment to burn up most of the oxygen present, and then heated to the melting point of the copper-silver alloy filler in an air-tight environment having an amount of inert gas sufficient to displace oxygen so as to avoid oxidation of the components, making the filler melt and evenly spread over the gaps at the junctions of the components. The assembled components may then be cooled to solidify the liquid filler at the junctions, to form a finished product. Also, an assembly line system for brazing the components of a heat sink module is described.

1 . A method of brazing components of a heat sink module comprising the steps of: 
 (a) assembling the components to be brazed;    (b) placing a copper-silver alloy filler at junctions between the components;    (c) pre-heating the assembled components in an air-tight environment to burn up most of the oxygen present;    (d) heating the assembled components to the melting point of the copper-silver alloy filler in an air-tight environment having an amount of inert gas sufficient to displace oxygen so as to avoid oxidation of the components, thereby making the filler melt and evenly spread over the gaps at the junctions of the components; and    (e) cooling the assembled components to solidify the liquid filler at the junctions, thereby forming a finished product.    
   
   
       2 . The method of  claim 1 , wherein the components of the heat sink module comprise a heat pipe, fins and base.  
   
   
       3 . The method of  claim 1 , wherein the components are components of a heat sink plate for a central processing unit of a computer.  
   
   
       4 . The method of  claim 3 , wherein the computer is a notebook computer.  
   
   
       5 . The method of  claim 1 , wherein the components of the heat sink module are made of copper.  
   
   
       6 . The method of  claim 1 , wherein the placing of the filler at the junctions the junctions of the components is done by an automatic filling unit.  
   
   
       7 . The method of  claim 1 , wherein the assembled components are pre-heated at about 200° C.  
   
   
       8 . The method of  claim 1 , wherein the assembled components are heated up to about 800° C. to melt the filler.  
   
   
       9 . The method of  claim 1 , wherein the inert gas comprises N 2 .  
   
   
       10 . An assembly line system for brazing the components of a heat sink module comprising: 
 material input means for introducing assembled components to be brazed;    means for placing copper-silver alloy filler at the junctions of the components to join them and to seal them;    a heating unit having an air-tight internal heating chamber for pre-heating the assembled components to burn up most of the oxygen present;    a brazing unit having an air-tight inert gas chamber containing an amount of inert gas sufficient to displace oxygen so as to avoid oxidation of the components, and means for heating the assembled components to a melting point of the filler so as to make the filler melt and evenly spread over the gaps at the junctions of the components;    a cooling unit having a cooling chamber for rapidly chilling the assembled components to solidify the liquid filler at the junctions, thereby forming a finished product;    material output means for removing finished products; and    a continuous annular conveying device encompassing and connecting the above units to form a automatic and sequential structure.    
   
   
       11 . The assembly line system of  claim 11 , wherein the means for placing copper-silver alloy filler is a filling device installed at the material input means.  
   
   
       12 . The assembly line system of  claim 12 , wherein the filling device is an automatic filling unit.  
   
   
       13 . The assembly line system of  claim 11 , wherein the heating unit comprises a heating chamber in which the assembled components are pre-heated to about 200° C.  
   
   
       14 . The assembly line system of  claim 11 , wherein the brazing unit comprises a passivation chamber in which the assembled components are heated up to about 800° C.  
   
   
       15 . The assembly line system of  claim 11 , wherein the inert gas to displace oxygen comprises N 2 .  
   
   
       16 . The assembly line system of  claim 11 , wherein the assembled components are components of a heat sink plate for a central processing unit of a computer.  
   
   
       17 . The assembly line system of  claim 11 , wherein the computer is a notebook computer.  
   
   
       18 . The assembly line system of  claim 11 , wherein the assembled components comprise at least one heat pipe, at least one heating fin, and a base.  
   
   
       19 . The assembly line system of  claim 11 , wherein the components of the heat sink module are made of copper.  
   
   
       20 . A method of brazing components of a heat sink module comprising the steps of: 
 providing components of the heat sink module to be brazed;    placing a copper filler on joints of the components and assembling the components;    pre-heating the assembled components in an air-tight heating unit to burn up most of the oxygen and pollutants on surfaces of the components;    heating the assembled components to the melting point of the copper filler in an air-tight brazing unit that has an amount of inert gas sufficient to displace oxygen so as to avoid oxidation of the components, thereby making the filler melt and evenly spread over the gaps at the junctions of the components; and    cooling the assembled components to solidify the liquid copper filler at the joints and form the heat sink module.