Titanium-copper alloy having excellent conductivity and method of producing the same

Abstract

The present invention provides a titanium-copper alloy having high strength and excellent conductivity as a copper alloy comprising: three to four percent by mass of Ti, residual Cu, and inevitable impurities, wherein the area percentage (S(%)) of a Cu—Ti intermetallic compound phase observed in a section perpendicular to the rolling direction is represented by the following formula: S(%)≧8.1×[Ti]−17.7 where [Ti] represents the Ti content in percent by mass. A method for producing the same is also provided.

1 . A titanium-copper alloy having high strength and conductivity as a copper alloy comprising: 
 three to four percent by mass of Ti,    residual Cu, and    inevitable impurities,    wherein the area percentage (S(%)) of a Cu—Ti intermetallic compound phase observed in a section perpendicular to the rolling direction is represented by the following formula:      S(%)≧8.1×[Ti]−17.7    where [Ti] represents the Ti content in percent by mass.    
   
   
       2 . A titanium-copper alloy according to  claim 1 , wherein a conductivity is 16% IACS or more, and 0.2% proof stress is 800 MPa or more.  
   
   
       3 . A method of producing a titanium-copper alloy according to  claim 1  or  2  comprising the steps of: 
 hot-rolling, cold-rolling, solution-treating, cold-rolling, and aging an ingot,    wherein a cold working degree prior to the aging is 15% or more, the aging temperature is from 350° C. to 450° C., the aging time is from 5 to 20 hours, and the average cooling rate from the aging temperature after the aging to 300° C. is 50° C./h or less.