Wafer-adhering adhesive tape

Abstract

A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.

1 . A wafer-adhering adhesive tape, having a radiation-curable removable adhesive layer on a surface of a base, 
 wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and said radiation-curable removable adhesive layer has a gel fraction of 60% or greater.    
     
     
         2 . A wafer-adhering adhesive tape having a radiation-curable removable adhesive layer and a die-bonding adhesive layer, in this order, on a surface of a base, 
 wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and said radiation-curable removable adhesive layer has a gel fraction of 60% or greater.    
     
     
         3 . The wafer-adhering adhesive tape according to  claim 1  or  2 , wherein the ratio of carbon-carbon double bonds contained in the radiation-curable removable adhesive layer is 0.5 to 2.0 meq/g.