PC adapter cards and method of manufacturing the same

Abstract

A method of manufacturing a mini-card with a semiconductor memory device includes the steps of (a) providing an array of substrates including a plurality of individual substrates; (b) mounting a semiconductor memory device on each of the individual substrates forming the substrate array; (c) covering the individual substrates with respective cases; and (d) dividing the substrate array to provide encased individual substrates each completing a mini card having the semiconductor memory device embedded therein.

1 - 5 . (canceled)  
   
   
       6 . A method of manufacturing mini-card with semiconductor memory device comprising the steps of: 
 providing a substrate array including a first portion, a second portion and a third portion connecting between the first portion and the second portion;    mounting a first semiconductor memory device on an upper surface of the first portion, and a second semiconductor memory device on an upper surface of the second portion,    after the step of mounting the first semiconductor memory device and the second semiconductor memory device, forming a plastic case covering the first and the second semiconductor devices on both surfaces of the first portion and the second portion by molding; and    after the step of forming the plastic case, cutting the third portion so as to separate the encased first portion and the second portion individually.    
   
   
       7 . The method of manufacturing mini-card with semiconductor memory device according to  claim 6 , wherein, in the plastic case forming step, the substrate array is partially exposed outwardly of the case.  
   
   
       8 . The method of manufacturing mini-card with semiconductor memory device according to  claim 6 , wherein, in the plastic case forming step, forming the plasting case by molding Into a mold.  
   
   
       9 . The method of manufacturing mini-card with semiconductor memory device according to  claim 6 , wherein, in the cutting step, cutting the third portion with a cutter.  
   
   
       10 . The method of manufacturing mini-card with semiconductor memory device according to  claim 6 , wherein, the substrate including a plurality of portions arrayed in longitudinal direction and horizontal direction.  
   
   
       11 . The method of manufacturing mini-card, with semiconductor memory device according to claim  1 , wherein, each of the first semiconductor memory device and the second semiconductor memory device is non-volatile semiconductor memory device.  
   
   
       12 . The method of manufacturing mini-card with semiconductor memory device according to claim  1 , wherein, further comprising a step of mounting a capacitor on each of the first portion and the second portion before the step of forming the plastic case.  
   
   
       13 . The method of manufacturing mini-card with semiconductor memory device according to claim  1 , wherein, the mounting step of the first semiconductor memory device and the second semiconductor memory device is performed by soldering.