Substrate carrier for processing substrates

Abstract

A substrate carrier for carrying one or more substrates comprises a bottom surface, a top surface opposed to the bottom surface, one or more recesses formed into the top surface, each of the one or more recesses having a support surface that defines a support region for a substrate. The support region is adapted to contact a bottom of the substrate. The support region may have a thickness less than a depth of the one or more recesses. The support region may comprise a porous material to permit thermal fluid to percolate through the support region.

1 . A substrate carrier for carrying one or more substrates comprising: 
 a bottom surface configured to be separable from a substrate support of a process chamber via lift pins;    a top surface opposed to the bottom surface; and    one or more recesses formed into the top surface, each of the one or more recesses having a support surface that defines a support region for a substrate, wherein the support region comprises is a porous material and is adapted to contact a bottom of the substrate.    
   
   
       2 . The substrate carrier of  claim 1 , wherein the support region is between the bottom surface and the support surface, and wherein the support region has a thickness less than a depth of the one or more recesses.  
   
   
       3 . The substrate carrier of  claim 1 , wherein the porous material has an open porosity between about 1 percent and about 20 percent.  
   
   
       4 . The substrate carrier of  claim 1 , wherein the porous material comprises a material selected from the group consisting of silicon carbide, silicon nitride, aluminum oxide, a metallic material, and combinations thereof.  
   
   
       5 . The substrate carrier of  claim 1  wherein the support region comprises an indicator for determining when the substrate has been etched through.  
   
   
       6 . The substrate carrier of  claim 1  wherein one of the one or more recesses have a substantially rectangular support surface.  
   
   
       7 . The substrate carrier of  claim 1 , wherein the support region is more reactive to etchants than the top surface.  
   
   
       8 . A substrate carrier for carrying one or more substrates comprising: 
 a bottom surface configured to sit on an upper surface of a substrate support of a processing chamber;    a top surface opposed to and substantially parallel to the bottom surface;    an edge surface circumscribing the top surface and the bottom surface; and    one or more recesses formed into the top surface, the one or more recesses having a porous support surface that defines a support region for a substrate.    
   
   
       9 . The substrate carrier of  claim 8  wherein the support region is between the bottom surface and the support surface, and wherein the support region has a thickness less than a depth of the one or more recesses.  
   
   
       10 . The substrate carrier of  claim 8 , wherein the porous material has an open porosity between about 1 percent and about 20 percent.  
   
   
       11 . The substrate carrier of  claim 8  wherein the support region has a thickness between about 0.02 centimeters and about 0.8 centimeters.  
   
   
       12 . The substrate carrier of  claim 8  wherein the support region comprises an indicator for determining when the substrate has been etched through.  
   
   
       13 . The substrate carrier of  claim 16  further comprising outer regions bounded by the top surface and the bottom surface and coupled to the support region, wherein the outer regions comprise a material having an open porosity less than the open porosity of the porous material in the support region.  
   
   
       14 . The substrate carrier of  claim 8  wherein one or more surfaces selected from the group consisting of the top surface, the edge surface, the containment surface, and combinations thereof have a protective coating formed thereon.  
   
   
       15 . The substrate carrier of  claim 14  wherein the protective coating comprises a material selected from the list consisting of alumina, sapphire, a polytetrafluoroethylene material, a perfluoroalkoxy material, and combinations thereof.  
   
   
       16 . The substrate carrier of  claim 15 , wherein the support region further comprises: 
 a material disposed on or embedded in the support region which, when exposed through the substrate during etching, has a characteristic detectable by an etch endpoint detection system as indicative of breakthrough of the substrate.    
   
   
       17 . The substrate carrier of  claim 8 , wherein the support region is reactive with a fluorinated gas.  
   
   
       18 . The substrate carrier of  claim 8 , wherein the support region is more reactive to etchants than the top surface.  
   
   
       19 . The substrate carrier of  claim 18 , wherein the support region further comprises: 
 a material disposed on or embedded in the support region which, when exposed through the substrate during etching, has a characteristic detectable by an etch endpoint detection system as indicative of breakthrough of the substrate.    
   
   
       20 . The substrate carrier of  claim 18 , wherein the support region is reactive with a fluorinated gas.  
   
   
       21 . A substrate carrier for carrying one or more substrates comprising: 
 a bottom surface;    a top surface opposite the bottom surface, the top surface comprised of a material substantially non-reactive to fluorinated etchants; and    one or more recesses formed in the top surface and having a substrate support surface comprised of a material reactive to fluorinated etchants.    
   
   
       22 . The substrate carrier of  claim 21 , wherein the substrate support region further comprises: 
 at least one gas passage formed therethrough.    
   
   
       23 . The substrate carrier of  claim 21 , wherein the top surface is comprised of a ceramic material.  
   
   
       24 . The substrate carrier of  claim 21  further comprising: 
 a coating disposed on the top surface, wherein the coating is at least one of aluminum oxide, sapphire, a perfluoroalkoxy material or a polytetrafluoroethylene material.    
   
   
       25 . The substrate carrier of  claim 21 , wherein the top surface is comprised of an aluminum material.