SIM card socket and method for manufacturing the same

Abstract

A SIM card socket and method for manufacturing the same. The SIM card socket includes a base, a first engaging member, and a second engaging member. The base includes a first side and a second side opposite thereto. The first engaging member is fixed on the first side of the base. The second engaging member is disposed on the second side of the base in an elastically deformable manner. The manufacturing method includes the following steps. A conductive base with a plurality of protrusions is provided. An isolating member is formed on the conductive base, and the protrusions are partially covered by the isolating member. The protrusions are cut so as to not connect with each other.

1 - 9 . (canceled)  
   
   
       10 . A method for manufacturing a SIM card socket comprising: 
 providing a conductive base with a plurality of protrusions;    forming an isolating member on the conductive base, wherein the protrusions are partially covered by the isolating member; and    cutting the protrusions so as to not connect with each other.    
   
   
       11 . The method as claimed in  claim 10 , further comprising: 
 after forming the isolation member on the conductive base, bending the protrusions.    
   
   
       12 . The method as claimed in  claim 11 , wherein each protrusion is bent into an inverted-V shape.  
   
   
       13 . The method as claimed in  claim 11 , wherein the thickness of the isolation member is variable according to an angle at which the protrusion is bent.  
   
   
       14 . The method as claimed in  claim 10 , further comprising: 
 after forming the isolation member on the conductive base, bending the conductive base to form a first engaging member.    
   
   
       15 . The method as claimed in  claim 10 , further comprising: 
 after forming the isolation member on the conductive base, bending the conductive base to form a second engaging member.    
   
   
       16 . The method as claimed in  claim 10 , further comprising: 
 after forming the isolation member on the conductive base, pressing the conductive base to form an elastic member.    
   
   
       17 . The method as claimed in  claim 10 , further comprising: 
 after forming the isolation member on the conductive base, bending the conductive base to form a wall.    
   
   
       18 - 26 . (canceled)