Silver alloy film, flat panel display, and sputtering-target material used for forming the silver alloy film

Abstract

Provided is a silver alloy film for which good properties of corrosion resistance, heat resistance and adhesiveness are required in thin-film electronic components such as a flat panel display, various semiconductor devices, a thin-film sensor and a magnetic head, a display device having the silver alloy film, and a sputtering-target material for forming the silver alloy film. The silver alloy film consists of, by atomic %, 0.1 to 1.0% Si, 0.1 to 0.7% in total of at least one element selected from the group consisting of Cu, Ti and Ge, and the balance of Ag and unavoidable impurities, wherein a total amount of all the additive elements to Ag is not more than 1.5%.

1 . A silver alloy film consisting essentially of, by atomic percent, 0.1 to 1.0% Si, 0.1 to 0.7% in total of at least one element selected from the group consisting of Cu, Ti and Ge, and the balance of Ag and unavoidable impurities, wherein a total amount of all the additive elements to Ag is not more than 1.5%.  
   
   
       2 . A silver alloy film according to  claim 1 , which is of a wiring film for flat panel displays.  
   
   
       3 . A silver alloy film according to  claim 1 , which has a resistivity of 5 μΩcm.  
   
   
       4 . A silver alloy film according to  claim 1 , consisting essentially of, by atomic percent, 0.1 to 0.5% Si, 0.1 to 0.4% in total of at least one element selected from the group consisting of Cu, Ti and Ge, and the balance of Ag and unavoidable impurities, wherein a total amount of all the additive elements to Ag is not more than 0.8%.  
   
   
       5 . A silver alloy film according to  claim 4 , which is of a wiring film for flat panel displays.  
   
   
       6 . A silver alloy film according to  claim 5 , which has a resistivity of 5 μΩcm.  
   
   
       7 . A flat panel display comprising a wiring film made of a silver alloy consisting essentially of, by atomic percent, 0.1 to 1.0% Si, 0.1 to 0.7% in total of at least one element selected from the group consisting of Cu, Ti and Ge, and the balance of Ag and unavoidable impurities, wherein a total amount of all the additive elements to Ag is not more than 1.5%.  
   
   
       8 . A flat panel display according to  claim 7 , comprising a wiring film made of a silver alloy consisting essentially of, by atomic percent, 0.1 to 0.5% Si, 0.1 to 0.4% in total of at least one element selected from the group consisting of Cu, Ti and Ge, and the balance of Ag and unavoidable impurities, wherein a total amount of all the additive elements to Ag is not more than 0.8%.  
   
   
       9 . A sputtering-target material used for forming a silver alloy film, consisting essentially of, by atomic percent, 0.1 to 1.0% Si, 0.1 to 0.7% in total of at least one element selected from the group consisting of Cu, Ti and Ge, and the balance of Ag and unavoidable impurities, wherein a total amount of all the additive elements to Ag is not more than 1.5%.  
   
   
       10 . A sputtering-target material according to  claim 9 , consisting essentially of, by atomic percent, 0.1 to 0.5% Si, 0.1 to 0.4% in total of at least one element selected from the group consisting of Cu, Ti and Ge, and the balance of Ag and unavoidable impurities, wherein a total amount of all the additive elements to Ag is not more than 0.8%.