Selective area solder placement

Abstract

A printed circuit board having at least one layer of conductive traces on an external surface has at least one preformed solder element placed on a conductive trace area of the printed circuit board requiring a greater than standard amount of solder. The at least one preformed solder element is reflowed to form a connection with the layer of printed solder.

1 . A method of producing a printed circuit board, comprising 
 applying a layer of printed solder to conductive trace areas of the printed circuit board requiring a standard amount of solder;    placing at least one preformed solder element on at least one conductive trace area of the printed circuit board requiring a greater than standard amount of solder; and    reflowing the at least one preformed solder element to form a connection between the layer of printed solder and the at least one preformed solder element.    
   
   
       2 . The method of  claim 1 , wherein the at least one preformed solder element has a hole passing through the solder element.  
   
   
       3 . The method of  claim 1 , wherein the at least one preformed solder element is a rectangular solder element.  
   
   
       4 . The method of  claim 1 , wherein the placing at least one preformed solder element on a conductive trace area of the printed circuit board is performed using electronic component placement equipment.  
   
   
       5 . The method of  claim 1 , wherein the reflowing the at least one preformed solder element occurs after placement of components on the printed circuit board.  
   
   
       6 . The method of  claim 5 , wherein the reflowing the at least one preformed solder element forms a connection between the printed layer of solder, the at least one solder element, and a component placed on the printed circuit board.  
   
   
       7 . A method of applying solder to a printed circuit board, comprising: 
 placing at least one preformed solder element on at least one conductive trace area of the printed circuit board; and    reflowing the at least one preformed solder element to form a connection between the layer of printed solder and the at least one preformed solder element.    
   
   
       8 . The method of  claim 7 , wherein the at least one preformed solder element has a hole passing through the solder element.  
   
   
       9 . The method of  claim 7 , wherein the at least one preformed solder element is a rectangular solder element.  
   
   
       10 . The method of  claim 7 , wherein the placing at least one preformed solder element on a conductive trace area of the printed circuit board is performed using electronic component placement equipment.  
   
   
       11 . The method of  claim 7 , wherein the reflowing the at least one preformed solder element occurs after placement of components on the printed circuit board.  
   
   
       12 . The method of  claim 11 , wherein the reflowing the at least one preformed solder element forms a connection between the printed layer of solder, the at least one solder element, and a component placed on the printed circuit board.