Microdevice with movable microplatform and process for making thereof

Abstract

A process for making a microdevice that includes the steps of providing a base member and selectively electroforming a support member for supporting a microplatform with respect to the base member. The process also includes the steps of selectively electroforming the microplatform and forming a flexible hinge member for hingedly connecting the microplatform to the support member and allowing relative movement of the microplatform with respect to the support member. This microdevice, when compared to prior art devices, can have improved mechanical strength, rigidity, low deformation, and high planarity.

1 - 13 . (canceled)  
   
   
       14 . A microdevice comprising: 
 a base member;    at least one selectively electroformed support member mountably connected to the base member;    at least one selectively electroformed hinge member mountably connected to said at least one support member; and    a selectively electroformed microplatform hingedly connected to said at least one hinge member for allowing relative movement of the microplatform with respect to said at least one support member.    
   
   
       15 - 20 . (canceled)  
   
   
       21 . A process for making the microdevice as defined in  claim 14 , the process comprising the steps of: 
 a) providing the base member;    b) selectively electroforming said at least one support member for supporting a microplatform with respect to the base member, said at least one support member being selectively electroformed in at least one first opening that is produced by photolitographically patterning a first photoresist layer;    c) selectively electroforming the microplatform, the microplatform being selectively electroformed in a second opening that is produced by photolitographically patterning a second photoresist layer; and    d) selectively electroforming said at least one flexible hinge member for hingedly connecting the microplatform to said at least one support member and allowing relative movement of the microplatform with respect to said at least one support member, said at least one flexible hinge member being selectively electroformed in at least one third opening that is produced by photolitographically patterning a third photoresist layer.    
   
   
       22 . The process for making the microdevice (according to  claim 21 , wherein: 
 step b) comprises the step of mountably connecting said at least one support member to the base member;    step d) is performed after step b) and before step c) and comprises the step of mountably connecting said at least one hinge member to said at least one support member; and    step c) comprises the step of mountably connecting the microplatform to said at least one hinge member.    
   
   
       23 . The process for making the microdevice according to  claim 22 , wherein step a) comprises the steps of: 
 i) providing a substrate;    ii) connecting at least one electrode and at least one contact pad onto a side of the substrate;    iii) covering said side with a protective layer; and    iv) providing at least one opening in the protective layer for accessing said at least one contact pad, thereby providing the base member.    
   
   
       24 . The process for making the microdevice according to  claim 23 , wherein step b) comprises the steps of: 
 v) covering, after step iv), said side with a first seed layer;    vi) covering, after step v), said side with the first photoresist layer; and    vii) photolitographically patterning the first photoresist layer to produce said at least one first opening on the first photoresist layer that is aligned with said at least one opening for accessing said at least one contact pad, said at least one support member being selectively electroformed in said at least one first opening of the first photoresist layer.    
   
   
       25 . The process for making the microdevice according to  claim 24 , wherein step d) comprises the steps of: 
 viii) covering, after step vii), said side with a second seed layer;    ix) covering the second seed layer with the third photoresist layer; and    x) photolitographically patterning the third photoresist layer to produce said at least one third opening on the third photoresist layer that is aligned with said at least one support member, said at least one hinge member being selectively electroformed in said at least one third opening of the third photoresist layer.    
   
   
       26 . The process for making the microdevice according to  claim 25 , wherein step c) comprises the steps of: 
 xi) removing, after step x), the third photoresist layer;    xii) covering, after step xi), said side with the second photoresist layer;    xiii) photolitographically patterning the second photoresist layer to produce the second opening on the second photoresist layer, the microplatform being selectively electroformed in the second opening of the second photoresist layer;    xiv) removing, after step xiii), the second photoresist layer;    xv) selectively removing, after step xiv), a part of the second seed layer that is unprotected by said at least one hinge member;    xvi) removing, after step xv), the first photoresist layer; and    xvii) removing, after step xvi), the first seed layer and another part of the second seed layer unprotected by said at least one support member for defining a cavity between the microplatform and the base member.    
   
   
       27 . The process for making the microdevice according to  claim 26 , wherein step c) further comprises the step of polishing an upper surface of the microplatform after step xiii).  
   
   
       28 . The process for making the microdevice according to  claim 21 , wherein: 
 step c) is performed before steps b) and d) and comprises the step of selectively electroforming the microplatform on a sacrificial substrate;    step d) is performed before step b) and comprises the step of mountably connecting said at least one hinge member to the microplatform;    step b) comprises the steps of mountably connecting said at least one support member to said at least one hinge member, and removing the sacrificial substrate; and    step a) comprises the step of mountably connecting said at least one support member to the base member, after the step of removing the sacrificial substrate.    
   
   
       29 . The process for making the microdevice according to  claim 28 , wherein step c) comprises the steps of: 
 i) covering a side of the sacrificial substrate with a first seed layer;    ii) covering the first seed layer with the second photoresist layer; and    iii) photolitographically patterning the second photoresist layer to produce the second opening on the second photoresist layer, the microplatform being selectively electroformed in the second opening of the second photoresist layer.    
   
   
       30 . The process for making the microdevice according to  claim 29 , wherein step d) comprises the steps of: 
 iv) covering, after step iii), said side with a second seed layer;    v) covering, after step iv), said side with the third photoresist layer;    vi) photolitographically patterning the third photoresist layer to produce said at least one third opening on the third photoresist layer that is aligned with the microplatform; and    vii) selectively electroforming said at least one hinge member in said at least one third opening of the third photoresist layer.    
   
   
       31 . The process for making the microdevice according to  claim 30 , wherein step b) comprises the steps of: 
 viii) removing, after step vii), the third photoresist layer;    ix) covering, after step viii), said side with the first photoresist layer;    x) photolitographically patterning the first photoresist layer to produce said at least one first opening on the first photoresist layer, said at least one support member being selectively electroformed in said at least one first opening of the first photoresist layer;    xi) selectively electroforming, after step x), a soldering material on said at least one support member;    xii) removing, after step xi), the first photoresist layer;    xiii) removing, after step xii), a part of the second seed layer unprotected by said at least one support member and hinge member;    xiv) removing, after step xiii), the second photoresist layer; and    xv) removing, after step xiv), the first seed layer for separating the sacrificial substrate from the microplatform.    
   
   
       32 . The process for making the microdevice according to  claim 31 , wherein step a) comprises the steps of: 
 xvi) providing a substrate;    xvii) connecting, after step xvi), at least one electrode and at least one contact pad onto a side of the substrate;    xviii) covering the side of said substrate with a protective layer;    xix) providing at least one opening in the protective layer for accessing said at least one contact pad, thereby providing the base member; and    xx) soldering, after step xix), said at least one support member onto the base member, via the soldering material and said at least one contact pad.    
   
   
       33 . The process for making the microdevice according to  claim 21  wherein: 
 step b) is performed before steps c) and d) and comprises the step of selectively electroforming said at least one support member on a sacrificial substrate;    step d) is performed before step c) and comprises the step of mountably connecting said at least one hinge member to said at least one support member;    step c) comprises the steps of mountably connecting the microplatform to said at least one hinge member, and removing the sacrificial substrate; and    step a) comprises the step of mountably connecting said at least one support member of the base member, after the step of removing the sacrificial substrate.    
   
   
       34 . The process for making the microdevice according to  claim 33 , wherein step b) comprises the steps of: 
 i) covering a side of the sacrificial substrate with a first seed layer;    ii) covering the first seed layer with the first photoresist layer; and    iii) photolitographically patterning the first photoresist layer to produce said at least one first opening on the first photoresist layer, said at least one support member being selectively electroformed in said at least one first opening of the first photoresist layer.    
   
   
       35 . The process for making the microdevice according to  claim 34 , wherein step iii) comprises the step of selectively electroforming a soldering material on said at least one first opening before said at least one support member is selectively electroformed therein.  
   
   
       36 . The process for making the microdevice according to  claim 34 , wherein step d) comprises the steps of: 
 iv) covering, after step iii), said side with a second seed layer;    v) covering, after step iv), said side with the third photoresist layer;    vi) photolitographically patterning the third photoresist layer to produce said at least one third opening on the third photoresist layer that is aligned with said at least one support member; and    vii) selectively electroforming said at least one hinge member in said at least one third opening of the third photoresist layer.    
   
   
       37 . The process for making the microdevice according to  claim 36 , wherein step c) comprises the steps of: 
 viii) removing, after step vii), the third photoresist layer;    ix) covering, after step viii), said side with the second photoresist layer;    x) photolitographically patterning the second photoresist layer to produce the second opening on the second photoresist layer, the microplatform being selectively electroformed in the second opening of the second photoresist layer;    xi) removing, after step x), the second photoresist layer;    xii) removing, after step xi), a part of the second seed layer unprotected by said at least one support member and hinge member;    xiii) removing, after step xii), the first photoresist layer; and    xiv) removing, after step xiv), the first seed layer for separating the sacrificial substrate from the soldering material.    
   
   
       38 . The process for making the microdevice according to  claim 37 , wherein step a) comprises the steps of: 
 xv) providing a substrate;    xvi) connecting, after step xv), at least one electrode and at least one contact pad onto a side of the substrate;    xvii) covering the side of said substrate with a protective layer;    xviii) providing at least one opening in the protective layer for accessing said at least one contact pad, thereby providing the base member; and    xix) soldering, after step xviii), said at least one support member onto the base member, via the soldering material and said at least one contact pad.    
   
   
       39 . The process for making the microdevice according to  claim 21 , wherein: 
 step d) is performed before step c) and comprises the step of selectively electroforming said at least one hinge member on a sacrificial substrate;    step c) comprises the steps of mountably connecting the microplatform to said at least one hinge member and removing the sacrificial substrate; and    step b) is performed after step a) and comprises the step of mountably connecting said at least one support member to the base member.    
   
   
       40 . The process for making the microdevice according to  claim 39 , wherein: 
 step d) comprises the steps of: 
 i) covering a side of the sacrificial substrate with a first seed layer;  
 ii) covering the first seed layer with the third photoresist layer; and  
 iii) photolitographically patterning the third photoresist layer to produce said at least one third opening on the third photoresist layer, said at least one hinge member being selectively electroformed in said at least one third opening of the third photoresist layer.  
   
   
   
       41  The process for making the microdevice according to  claim 40 , wherein step iii) comprises the step of selectively electroforming a soldering material on said at least one third opening before said at least one hinge member is selectively electroformed therein.  
   
   
       42 . The process for making the microdevice according to  claim 41 , wherein step c) comprises the steps of: 
 iv) covering, after step iii), said side with a second seed layer;    v) covering, after step iv), said side with the second photoresist layer;    vi) photolitographically patterning the second photoresist layer to produce the second opening on the second photoresist layer that is aligned with said at least one hinge member;    vii) selectively electroforming the microplatform in the second opening of the second photoresist layer;    viii) removing, after step vii), the second photoresist layer;    ix) removing, after step viii), a part of the second seed layer unprotected by the microplatform;    x) removing, after step ix), the third photoresist layer; and    xi) removing, after step x), the first seed layer for separating the sacrificial substrate from the soldering material.    
   
   
       43 . The process for making the microdevice according to  claim 42 , wherein: 
 step a) comprises the steps of: 
 xii) providing a substrate;  
 xiii) connecting, after step xii), at least one electrode and at least one contact pad onto a side of the substrate;  
 xiv) covering the side of said substrate with a protective layer; and  
 xv) providing at least one opening in the protective layer for accessing said at least one contact pad, thereby providing a base member; and  
   step b) comprises the steps of: 
 xvi) covering, after step xv), said side with a third seed layer;  
 xvii) covering, after step v), said side with the first photoresist layer;  
 xviii) photolitographically patterning the first photoresist layer to produce said at least one first opening on the first photoresist layer that is aligned with said at least one opening for accessing said at least one contact pad, said at least one support member being selectively electroformed in said at least one first opening of the first photoresist layer;  
 xix) removing, after step xviii), the first photoresist layer;  
 xx) selectively removing, after step xix), a part of the third seed layer unprotected by said at least one support member; and  
 xxi) soldering, after step xx), said at least one hinge member onto said at least one support member, via the soldering material.  
   
   
   
       44 . The process for making the microdevice according to  claim 40 , wherein step b) comprises the step of selectively electroforming a soldering material on said at least one support member.  
   
   
       45 . The process for making the microdevice according to  claim 44 , wherein step c) comprises the steps of: 
 iv) covering, after step iii), said side with a second seed layer;    v) covering, after step iv), said side with the second photoresist layer;    vi) photolitographically patterning the second photoresist layer to produce the second opening on the second photoresist layer that is aligned with said at least one hinge member;    vii) selectively electroforming the microplatform in the second opening of the second photoresist layer;    viii) removing, after step vii), the second photoresist layer;    ix) removing, after step viii), a part of the second seed layer unprotected by the microplatform;    x) removing, after step ix), the third photoresist layer; and    xi) removing, after step x), the first seed layer for separating the sacrificial substrate from the hinge.    
   
   
       46 . The process for making the microdevice according to  claim 45 , wherein: 
 step a) comprises the steps of: 
 xii) providing a substrate;  
 xiii) connecting, after step xii), at least one electrode and at least one contact pad onto a side of the substrate;  
 xiv) covering the side of said substrate with a protective layer; and  
 xv) providing at least one opening in the protective layer for accessing said at least one contact pad, thereby providing the base member; and  
   step b) comprises the steps of: 
 xvi) covering, after step xv), said side with a third seed layer;  
 xvii) covering, after step v), said side with the first photoresist layer;  
 xviii) photolitographically patterning the first photoresist layer to produce said at least one first opening on the first photoresist layer that is aligned with said at least one opening for accessing said at least one contact pad, said at least one support member being selectively electroformed in said at least one first opening of the first photoresist layer;  
 xix) removing, after step xviii), the first photoresist layer;  
 xx) selectively removing, after step xix), a part of the third seed layer unprotected by said at least one support member; and  
 xxi) soldering, after step xx), said at least one hinge member onto said at least one support member, via the soldering material.  
   
   
   
       47 . The process for making the microdevice according to  claim 21 , wherein: 
 step d) is performed before step c) and comprises the step of selectively electroforming said at least one hinge member on a sacrificial substrate;    step c) comprises the steps of mountably connecting the microplatform to said at least one hinge member;    step b) is performed after step c) and comprises the steps of mountably connecting said at least one support member to said at least one hinge member and microplatform, and removing the sacrificial substrate ( 20 ); and    step a) is performed after step b) and comprises the step of mountably connecting said at least one support member to the base member.    
   
   
       48 . The process for making the microdevice according to  claim 47 , wherein step d) comprises the steps of: 
 i) covering a side of the sacrificial substrate with a first seed layer;    ii) covering the first seed layer with the third photoresist layer; and    iii) photolitographically patterning the third photoresist layer to produce at least one third opening on the third photoresist layer, said at least one hinge member being selectively electroformed in said at least one third opening of the third photoresist layer.    
   
   
       49 . The process for making the microdevice according to  claim 48 , wherein step c) comprises the steps of: 
 iv) removing, after step iii), the third photoresist layer;    v) covering, after step iv), said at least one hinge member with the second photoresist layer;    vi) photolitographically patterning the second photoresist layer to produce the second opening on the second photoresist layer that is aligned with said at least one hinge member; and    vii) selectively electroforming the microplatform in the second opening of the second photoresist layer.    
   
   
       50 . The process for making the microdevice according to  claim 47 , wherein step b) comprises the step of selectively electroforming a soldering material on said at least one support member, before the step of mountably connecting said at least one support member to the base member.  
   
   
       51 . The process for making the microdevice according to  claim 50 , wherein step b) comprises the steps of: 
 viii) removing, after step vii), the second photoresist layer;    ix) covering, after step viii), said microplatform with the first photoresist layer;    x) photolitographically patterning the first photoresist layer to produce said at least one first opening on the first photoresist layer that is aligned with said microplatform, said at least one support member being selectively electroformed in said at least one first opening of the first photoresist layer;    xi) removing, after step x), the first photoresist layer;    xii) removing, after step xi), the first seed layer for separating the sacrificial substrate ( 20 ) from said at least one hinge member; and    xiii) soldering, after step xii), said at least one support member onto said base member via the soldering material.    
   
   
       52 . The process for making the microdevice according to  claim 51 , wherein step a) comprises the steps of: 
 xiv) providing a substrate;    xv) connecting, after step xiv), at least one electrode and at least one contact pad onto a side of the substrate;    xvi) covering the side of said substrate with a protective layer; and    xvii) providing at least one opening in the protective layer for accessing said at least one contact pad, thereby providing the base member.