Thin film forming apparatus and thin film forming method

Abstract

Apparatus for forming a thin film pattern on the surface of a substrate. This apparatus is provided with: a transfer member having a thin film carrying surface which carries a thin film pattern; and a thin film transfer mechanism for joining the transfer member to a substrate for transferring, to the substrate, the thin film pattern on the thin film carrying surface. The thin film pattern may be a wiring film pattern. A gelatinous film may previously be formed on the substrate, and the thin film pattern may be transferred as embedded in the gelatinous film.

1 - 7 . (canceled)  
   
   
       8 . A method of forming a thin film pattern on a surface of a substrate, comprising the steps of: 
 forming a thin film pattern on a thin film carrying surface of a transfer member; and    joining the transfer member to a substrate having a film formed on a surface thereof, so as to transfer the thin film pattern from the thin film carrying surface to the substrate,    wherein the thin film pattern is transferred to the substrate so as to embed the thin film pattern in the film formed on the surface of the substrate.    
   
   
       9 . (canceled)  
   
   
       10 . A method according to  claim 8 , wherein the substrate is a substrate on which a wiring pattern or device is formed, and wherein the thin film pattern is a wiring film pattern.  
   
   
       11 . (canceled)  
   
   
       12 . A method according to  claim 8 , further comprising the step of forming a gelatinous film as the film formed on the surface of the substrate, and wherein the thin film pattern is transferred to the substrate so that the thin film pattern is embedded in the gelatinous film formed thereon.  
   
   
       13 . A method according to  claim 8 , further comprising the steps of forming, on a surface of the transfer member, a recess portion and a projecting portion, and wherein the thin film carrying surface is formed on the projecting portion.  
   
   
       14 . A method according to  claim 8 , wherein the transfer member has a flat surface and the thin film pattern is formed on a predetermined area of the flat surface.  
   
   
       15 . A method according to  claim 8 , wherein the thin film pattern is formed by plating.  
   
   
       16 - 18 . (canceled)  
   
   
       19 . A thin film forming method of forming a plurality of thin films on a substrate, comprising the steps of: 
 forming a plurality of thin films on a surface of a transfer member; and    joining, to the substrate, the transfer member having the plurality of thin films formed thereon for collectively transferring the plurality of thin films to the substrate.    
   
   
       20 . A method according to  claim 19 , wherein there are formed, on the surface of the transfer member, thin films of different types, and said joining step transfers said films to a same layer on the substrate.  
   
   
       21 . A method according to  claim 19 , wherein there are formed, on the surface of the transfer member, a plurality of thin films, and said joining step transfers said films to different layers on the substrate.  
   
   
       22 . A method according to  claim 19 , wherein the substrate is a semiconductor substrate.  
   
   
       23 . A method according to  claim 19 , wherein the substrate is an insulating substrate.  
   
   
       24 - 28 . (canceled)  
   
   
       29 . A method according to  claim 20 , wherein the thin films of different types include an insulating film and a metal wiring film.  
   
   
       30 . A method according to  claim 29 , wherein the thin films of different types are comprised in a multi-layer thin film wiring structure which is transferred onto the substrate in the joining step.  
   
   
       31 . A method according to  claim 21 , wherein the plurality of thin films include insulating films of two or more different types.  
   
   
       32 . A method according to  claim 21 , wherein the plurality of thin films includes an insulating film and a metal wiring film, comprised in a multi-layer thin film wiring structure which is transferred onto the substrate in the joining step.