Processing tool, method of producing processing tool, processing method and processing apparatus

Abstract

A processing tool is used to carry out a fixed-abrasive grinding process on a surface of a silicon work-piece. The processing tool includes abrasive grains made up silica grains. A primary average grain size of the silica grains is desirably 0.8 nm to 10 μm.

1 - 16 . (canceled)  
   
   
       17 . A processing method for carrying out a process on a disk-shaped or donut-shaped work-piece, comprising the steps of: 
 (a) grinding an outer peripheral surface of the work-piece by a grindstone; and    (b) polishing cutout part on the outer peripheral surface of the work-piece and/or an inner peripheral surface of the work-piece by a polishing film.    
   
   
       18 . The processing method as claimed in  claim 17 , wherein said step (a) uses a grindstone including abrasive grains which generate mechano-chemical reaction with respect to a processing surface of the work-piece.  
   
   
       19 . The processing method as claimed in  claim 18 , wherein the abrasive grains have a primary average grain size of 0.8 nm to 10 μm.  
   
   
       20 . The processing method as claimed in  claim 17 , wherein said step (b) uses a polishing film including abrasive grains which generate mechano-chemical reaction with respect to a processing surface of the work-piece.  
   
   
       21 . The processing method as claimed in  claim 20 , wherein said step (b) uses a flexible polishing film.  
   
   
       22 . The processing method as claimed in  claim 20 , wherein the abrasive grains have a primary average grain size of 0.8 nm to μm.  
   
   
       23 . The processing method as claimed in  claim 17 , wherein said steps (a) and (b) respectively carry out a dry grinding process and a dry polishing process.  
   
   
       24 - 30 . (canceled)