Three-dimensional multichip stack electronic package structure

Abstract

The present invention relates to a three-dimensional multichip stack electronic package structure and method for making the same, including a main substrate having at least a pin-hole set and at least a flexible substrate having at least a pin terminal. At least an electronic device including an active component and a passive component is attached to the flexible substrate by adhesion. In the flexible substrate, electric signals of the electronic device are delivered to the pin terminal through at least a conductive wire for transmitting electric signals. In assembly, the pin terminal of the flexible substrate is inserted into the pin hole of the main substrate. Then, the flexible substrate is folded so as to package the electronic device in a three-dimensional multichip stack manner.

1 . A three-dimensional multichip stack electronic package structure, comprising: 
 a main substrate having at least a connection unit;    a flexible substrate including at least a second face, a third face, at least a conductive wire for transmitting electric signals and at least a pin terminal, wherein said pin terminal corresponds to said connection unit connected to and mounted on said main substrate and said conductive wire for transmitting electric signals is mounted on said second face; and    an electronic component having at least a contact pad connected to said second face of said flexible substrate;    wherein said conductive wire for transmitting electric signals of said flexible substrate has an end electrically connected to said pin terminal, said contact pad of said electronic component is electrically connected to said conductive wire for transmitting electric signals to deliver electric signals of said electronic component to said pin terminal, and said third face of said flexible substrate adheres to the face of an electronic component of another flexible substrate, the face of said main substrate or said second face of said another flexible substrate.    
   
   
       2 . The electronic package structure of  claim 1 , wherein said electronic component is an active component or a passive component.  
   
   
       3 . The electronic package structure of  claim 1 , wherein said connection unit is a connector or a pin hole.  
   
   
       4 . The electronic package structure of  claim 1 , wherein said flexible substrate has at least a set of pin holes for connection to the pin terminals of another flexible substrate.  
   
   
       5 . The electronic package structure of  claim 1 , wherein said third face of said flexible substrate adheres to the face of said electronic component on another flexible substrate or said second face of another flexible substrate in a folded manner, said flexible substrate being folded a single or plural times.  
   
   
       6 . The electronic package structure of  claim 1 , wherein said pin terminals are disposed on at least one side of said flexible substrate.  
   
   
       7 . The electronic package structure of  claim 1 , wherein said connection unit is disposed in the shape of two parallel lines, a triangle, a polygon, an ellipse or a combination thereof on said main substrate.  
   
   
       8 . The electronic package structure of  claim 1 , wherein said electronic component is connected to said flexible substrate by alloy reflow bonding, gluing, pressing or a combination thereof.  
   
   
       9 . The electronic package structure of  claim 1 , wherein the material of said pin terminals of said flexible substrate is selected from a group consisting of copper, copper alloy, gold, silver, palladium, platinum, aluminum/gold alloy, aluminum/palladium alloy, nickel/gold alloy, nickel/palladium alloy and a combination thereof.  
   
   
       10 . A three-dimensional multichip stack electronic packaging method, comprising the steps of: 
 (a) providing a main substrate having at least a connection unit;    (b) providing a flexible substrate including at least a second face, a third face, at least a conductive wire for transmitting electric signals and at least a pin terminal wherein said pin terminal corresponds to said connection unit connected to and mounted on said main substrate, said conductive wire for transmitting electric signals is mounted on said second face and said conductive wire for transmitting electric signals has an end electrically connected to said pin terminal;    (c) providing an electronic component having at least a contact pad connected to said second face of said flexible substrate;    (d) inserting said pin terminal of said flexible substrate into said connection unit of said main substrate; and    (e) adhering said third face of said flexible substrate to the faces of electronic components of another flexible substrate, the face of said main substrate or said second face of said another flexible substrate.    
   
   
       11 . The electronic packaging method of  claim 10 , wherein in step (b), said flexible substrate has at least a set of pin holes for connection to the pin terminals of another flexible substrate.  
   
   
       12 . The electronic packaging method of  claim 10 , wherein in step (a), said connection unit is a connector or a pin hole.  
   
   
       13 . The electronic packaging method of  claim 10 , wherein in step (e), said third face of said flexible substrate adheres to the face of said electronic component on another flexible substrate or said second face of another flexible substrate in a folded manner, said flexible substrate being folded a single or plural times.  
   
   
       14 . The electronic packaging method of  claim 10 , wherein in step (b), said pin terminals are disposed on at least one side of said flexible substrate.  
   
   
       15 . The electronic packaging method of  claim 10 , wherein in step (a), said connection unit is disposed in the shape of two parallel lines, a triangle, a polygon, an ellipse or a combination thereof on said main substrate.  
   
   
       16 . The electronic packaging method of  claim 10 , wherein in step (c), said electronic component is connected to said flexible substrate by alloy reflow bonding, gluing, pressing or a combination thereof.  
   
   
       17 . The electronic packaging method of  claim 10 , wherein in step (c), said electronic component is an active component or a passive component.  
   
   
       18 . The electronic packaging method of  claim 10 , wherein in step (b), the material of said pin terminals of said flexible substrate is selected from a group consisting of copper, copper alloy, gold, silver, palladium, platinum, aluminum/gold alloy, aluminum/palladium alloy, nickel/gold alloy, nickel/palladium alloy and a combination thereof.