Electrically conductive wire

Abstract

A method of soldering comprises disposing first and second balls of solder adjacent one another on a wire; disposing flux on the wire between and in contact with both of the first and second balls and so as to substantially fill a space between the first and second balls; disposing the wire on a substrate so that the first and second balls of solder contact a single conductor on the substrate; and melting the first and second balls of solder and flux and soldering the wire to the conductor.

1 - 6 . (canceled)  
   
   
       7 . A soldered product comprising: 
 a solderable assembly on a substrate,    the solderable assembly comprising an electrically conductive wire, a first solder ball fixed on said wire and a second solder ball fixed on said wire,    the first and second solder ball being disposed on a single contact,    the electrically conductive wire being placed on the substrate such that an end of the electrically conductive wire protrudes through the substrate onto an opposite side of the substrate from the first and second solder balls.    
   
   
       8 . The soldered product of  claim 7  wherein the wire further comprises a second conductive end protruding beyond the second solder ball, wherein the second end is inserted through the substrate for soldering from said opposite side.  
   
   
       9 . The soldered product of  claim 7 , wherein the solder balls are composed of tin, lead and bismuth.  
   
   
       10 . The soldered product of  claim 7 , wherein said first and second solder balls are each centered substantially around said wire.  
   
   
       11 . A substrate on which a solderable assembly is placed, the assembly comprising: (i) an electrically conductive wire, (ii) a first solder ball fixed on said wire, and (iii) a second solder ball fixed on said wire; 
 said second ball being joined to said first ball in an area separating said first and second solder balls and solder from the first and second solder balls substantially filling a space between the first and second solder balls;    wherein an end of the electrically conductive wire protrudes through the substrate onto an opposite side of the substrate from the first and second solder balls and the flux, and    the first and second solder balls being disposed on a single contact.    
   
   
       12 . The substrate of  claim 11  wherein the wire further comprises a second conductive end protruding beyond the second solder ball, which second end is inserted through the substrate for soldering from said opposite side.  
   
   
       13 . The soldered product of  claim 11 , wherein the solder balls are composed of tin, lead and bismuth.  
   
   
       14 . The soldered product of  claim 11 , wherein said first and second solder balls are each centered substantially around said wire.  
   
   
       15 . A system for manufacture of electronic components comprising: 
 means for disposing first and second balls of solder located adjacent one another on a wire;    means for disposing the wire on a substrate so that the first and second balls of solder are configured to be melted in soldering to contact a single conductor on the substrate;    means for melting the first and second balls of solder and flux and soldering the wire to the conductor.    
   
   
       16 . The system of  claim 15  wherein the means for melting comprises a wave soldering machine.  
   
   
       17 . A substrate comprising: 
 first and second balls of solder located adjacent one another on a wire;    flux on the wire between and in contact with the first and second solder balls, substantially filling a space between the first and second solder balls;    the wire being configured to be attached to the substrate at a single conductor on the substrate.