Semiconductor device, a method of manufacturing the same and an electronic device

Abstract

A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.

1 . A semiconductor device comprising: 
 a semiconductor chip having first and second main surfaces positioned on mutually opposite sides, a first electrode formed over the first main surface, and a second electrode formed over the second main surface;    a resin sealing member sealing the semiconductor chip, and having first and second main surfaces positioned on mutually opposite sides, the first main surface being positioned on the first main surface side of the semiconductor chip, and the second main surface being positioned on the second main surface side of the semiconductor chip;    a first conductive member in which one end side is positioned over the first electrode of the semiconductor chip and connected to the first electrode of the semiconductor chip through a first connecting means, and the other end side opposite to the one end side is positioned on the second main surface side of the resin sealing member relative to the one end side and exposed from the resin sealing member; and    a second conductive member connected to the second electrode of the semiconductor chip through a second connecting means,    wherein the one end side of the first conductive member is exposed from the first main surface of the resin sealing member, and    wherein the second conductive member is exposed from the second main surface and side faces of the resin sealing member.    
     
     
         2 . A semiconductor device according to  claim 1 , wherein the second conductive member projects from side faces of the resin sealing member.  
     
     
         3 . A semiconductor device according to  claim 1 , 
 wherein the other end side of the first conductive member is positioned on a first side-face side of the resin sealing member, and    wherein the second conductive member is exposed from a second side face opposite to the first side face of the resin sealing member.    
     
     
         4 . A semiconductor device according to  claim 1 , 
 wherein the other end side of the first conductive member is exposed from the second main surface and a first side face of the resin sealing member, and    wherein the second conductive member is exposed from a second side face opposite to the first side face of the resin sealing member.    
     
     
         5 . A semiconductor device according to  claim 1 , 
 wherein the first conductive member has a first portion a part of which is positioned over the first electrode of the semiconductor chip and another part of which projects to the outside of the semiconductor chip, a second portion formed integrally with the first portion, and a third portion positioned on the second main surface side of the resin sealing member relative to the first portion,    wherein the first portion is exposed from the first main surface of the resin sealing member, and    wherein the third portion is exposed from the resin sealing member.    
     
     
         6 . A semiconductor device according to  claim 5 , wherein the second portion is an offset portion for spacing the first portion and the third portion from each other in the thickness direction of the resin sealing member.  
     
     
         7 . A semiconductor device according to  claim 1 , 
 wherein the first conductive member has a first portion a part of which is positioned over the first electrode of the semiconductor chip and another part of which projects to the outside of the semiconductor chip, a second portion which is bent from the first portion to the second main surface side of the resin sealing member, and a third portion extending from the second portion in the same direction as the projecting direction of the first portion,    wherein the first portion is exposed from the first main surface of the resin sealing member, and    wherein the third portion is exposed from the resin sealing member.    
     
     
         8 . A semiconductor device according to  claim 1 , 
 wherein the first electrode of the semiconductor chip is a source electrode, and    wherein the second electrode of the semiconductor chip is a drain electrode.    
     
     
         9 . A semiconductor device according to  claim 1 , 
 wherein the first electrode of the semiconductor chip is a drain electrode, and    wherein the second electrode of the semiconductor chip is a source electrode.    
     
     
         10 . A semiconductor device according to  claim 1 , wherein the first connecting means is a salient electrode or an electrically conductive adhesive.  
     
     
         11 . A semiconductor device according to  claim 1 , wherein the second connecting means is a salient electrode or an electrically conductive adhesive.  
     
     
         12 . A semiconductor device comprising: 
 a semiconductor chip having an electrode over a main surface thereof;    a conductive member positioned over the electrode of the semiconductor chip and having a connecting portion connected to the electrode of the semiconductor chip through a plurality of salient electrodes; and    a resin sealing member for sealing the semiconductor chip, the plural salient electrodes, and the conductive member,    wherein the connecting portion of the conductive member has one or plural slits.    
     
     
         13 . A semiconductor device comprising: 
 a semiconductor chip having an electrode over a main surface thereof;    a conductive member positioned over the electrode of the semiconductor chip and having a connecting portion connected to the electrode of the semiconductor chip through a plurality of salient electrodes; and    a resin sealing member for sealing the semiconductor chip, the plural salient electrodes, and the conductive member,    wherein the connecting portion of the conductive member has one or plural grooves in the other portion than the area where the plural salient electrodes are connected.    
     
     
         14 . A semiconductor device comprising: 
 a semiconductor chip having first and second main surfaces positioned on mutually opposite sides, a first electrode formed over the first main surface, and a second electrode formed over the second main surface;    a resin sealing member sealing the semiconductor chip, and having first and second main surfaces positioned on mutually opposite sides, the first main surface being positioned on the first main surface side of the semiconductor chip, and the second main surface being positioned on the second main surface side of the semiconductor chip;    a first conductive member positioned over the first electrode of the semiconductor chip and connected to the first electrode of the semiconductor chip through a first connecting member, the first conductive member having a first portion exposed from the first main surface of the resin sealing member, a second portion formed integrally with the first portion and positioned in the interior of the resin sealing member, and a third portion formed integrally with the second portion and exposed from the second main surface of the resin sealing member; and    a second conductive member connected to the second electrode of the semiconductor chip through a second connecting means and exposed from the second main surface of the resin sealing member.    
     
     
         15 . A semiconductor device according to  claim 14 , 
 wherein the third portion of the first conductive member is exposed from a first side face of the resin sealing member, and    wherein the second conductive member is exposed from a second side face opposite to the first side face of the resin sealing member.    
     
     
         16 . A semiconductor device according to  claim 14 , wherein the second portion is an offset portion for spacing the first portion and the second portion from each other in the thickness direction of the resin sealing member.  
     
     
         17 . A semiconductor device according to  claim 12 , 
 wherein the first electrode of the semiconductor chip is a source electrode, and    wherein the second electrode of the semiconductor chip is a drain electrode.    
     
     
         18 . A semiconductor device according to  claim 14 , 
 wherein the first electrode of the semiconductor chip is a drain electrode, and    wherein the second electrode of the semiconductor chip is a source electrode.    
     
     
         19 . A semiconductor device comprising: 
 a semiconductor chip having first and second main surfaces positioned on mutually opposite sides, first and second electrodes formed over the first main surface, and a third electrode formed over the second main surface;    a resin sealing member sealing the semiconductor chip and having first and second main surfaces positioned on mutually opposite sides, the first main surface being positioned on the first main surface side of the semiconductor chip, and the second main surface being positioned on the second main surface side of the semiconductor chip;    a first conductive member having a first portion, a second portion, and a third portion, the first portion being connected to the first electrode of the semiconductor chip through a first connecting means, the second portion being formed integrally with the first portion, and the third portion being formed integrally with the second portion and positioned on the second main surface side of the resin sealing member relative to the first portion;    a second conductive member having a first portion, a second portion, and a third portion, the first portion being connected to the second electrode of the semiconductor chip through a second connecting means, the second portion being formed integrally with the first portion, and the third portion being formed integrally with the second portion and positioned on the second main surface side of the resin sealing member relative to the first portion; and    a third conductive member connected to the third electrode of the semiconductor chip through a third connecting means and exposed from the second main surface of the resin sealing member,    wherein the first portion of the first conductive member is exposed from the first main surface of the resin sealing member, and    wherein the first portion of the second conductive member is positioned in the interior of the resin sealing member.    
     
     
         20 . A semiconductor device according to  claim 19 , wherein the first portion of the second conductive member is smaller in thickness than the first portion of the first conductive member.  
     
     
         21 . A semiconductor device according to  claim 19 , 
 wherein the second portions of the first and second conductive members are positioned in the interior of the resin sealing member, and    wherein the third portions of the first and second conductive members are exposed from the second main surface of the resin sealing member.    
     
     
         22 . A semiconductor device according to  claim 21 , 
 wherein the third portions of the first and second conductive members are exposed from a first side face of the resin sealing member, and    wherein the third conductive member is exposed from a second side face opposite to the first side face of the resin sealing member.    
     
     
         23 . A semiconductor device according to  claim 19 , 
 wherein the first electrode of the semiconductor chip is a source electrode,    wherein the second electrode of the semiconductor chip is a gate electrode, and    wherein the third electrode of the semiconductor chip is a drain electrode.    
     
     
         24 . A semiconductor device according to  claim 19 , wherein the first and second connecting means are salient electrodes or conductive adhesives.  
     
     
         25 . A semiconductor device comprising: 
 a semiconductor chip having first and second main surfaces positioned on mutually opposite sides, first and second electrodes formed over the first main surface, and a third electrode formed over the second main surface;    a resin sealing member sealing the semiconductor chip and having first and second main surfaces positioned on mutually opposite sides, the first main surface being positioned on the first main surface side of the semiconductor chip, and the second main surface being positioned on the second main surface side of the semiconductor chip;    a first conductive member having a first portion, a second portion, and a third portion, the first portion being connected to the first electrode of the semiconductor chip through a first connecting means, the second portion being formed integrally with the first portion, and the third portion being formed integrally with the second portion and positioned on the second main surface side of the resin sealing member relative to the first portion;    a second conductive member positioned outside the semiconductor chip and on the second main surface side of the resin sealing member relative to the first portion of the first conductive member; and    a third conductive member connected to the third electrode of the semiconductor chip through a second connecting means and exposed from the second main surface of the resin sealing member,    wherein the first portion of the first conductive member is exposed from the first main surface of the resin sealing member, and    wherein the second conductive member is connected electrically to the second electrode of the semiconductor chip through a bonding wire.    
     
     
         26 . A semiconductor device according to  claim 25 , 
 wherein the second portion of the first conductive member is positioned in the interior of the resin sealing member, and    wherein the third portion of the first conductive member, as well as the second conductive member, are exposed from the second main surface of the resin sealing member.    
     
     
         27 . A semiconductor device comprising: 
 a semiconductor chip having first and second main surfaces positioned on mutually opposite sides, a first electrode formed over the first main surface, and a second electrode formed over the second main surface;    a resin sealing member sealing the semiconductor chip and having first and second main surfaces positioned on mutually opposite sides, the first main surface being positioned on the first main surface side of the semiconductor chip, and the second main surface being positioned on the second main surface side of the semiconductor chip;    a first conductive member having a first portion, a second portion, and a third portion, the first portion being connected to the first electrode of the semiconductor chip through a first connecting means, the second portion being formed integrally with the first portion, and the third portion being formed integrally with the second portion and positioned on the second main surface side of the resin sealing member relative to the first portion; and    a second conductive member having a first portion connected to the second electrode of the semiconductor chip through a second connecting means and a second portion formed integrally with the first portion and larger in thickness than the first portion,    wherein the first portion of the second conductive member is exposed from the second main surface of the resin sealing member, and    wherein the second portion of the second conductive member is exposed from the first and second main surfaces of the resin sealing member.    
     
     
         28 . A semiconductor device according to  claim 27 , wherein the second portion of the second conductive member is exposed from side faces of the resin sealing member.  
     
     
         29 . A semiconductor device according to  claim 27 , 
 wherein the first portion of the first conductive member projects from side faces of the resin sealing member, and    wherein the second and third portions of the first conductive member are positioned outside the resin sealing member.    
     
     
         30 . A semiconductor device according to  claim 27 , 
 wherein the first and second portions of the first conductive member are positioned in the interior of the resin sealing member, and    wherein the third portion of the first conductive member is exposed from the second main surface of the resin sealing member.    
     
     
         31 . A semiconductor device according to  claim 27 , wherein the first connecting means is a salient electrode or an electrically conductive adhesive.  
     
     
         32 . A semiconductor device according to  claim 27 , 
 wherein the first electrode of the semiconductor chip is a source electrode, and    wherein the second electrode of the semiconductor chip is a drain electrode.    
     
     
         33 . A semiconductor device according to  claim 27 , 
 wherein the first electrode of the semiconductor chip is a drain electrode, and    wherein the second electrode of the semiconductor chip is a source electrode.    
     
     
         34 . A semiconductor device comprising: 
 a semiconductor chip having first and second main surfaces positioned on mutually opposite sides, a first electrode formed over the first main surface, and a second electrode formed over the second main surface;    a resin sealing member sealing the semiconductor chip and having first and second main surfaces positioned on mutually opposite sides, the first main surface being positioned on the first main surface side of the semiconductor chip, and the second main surface being positioned on the second main surface side of the semiconductor chip;    a first conductive member having a first portion connected to the first electrode of the semiconductor chip through a first connecting means and a second portion formed integrally with the first portion and larger in thickness than the first portion; and    a second conductive member having a first portion connected to the second electrode of the semiconductor chip through a second connecting means and a second portion formed integrally with the first portion and larger in thickness than the first portion,    wherein the first portion of the first conductive member is exposed from the first main surface of the resin sealing member,    wherein the second portion of the first conductive member is exposed from the first and second main surfaces of the resin sealing member,    wherein the first portion of the second conductive member is positioned in the interior of the resin sealing member, and    wherein the second portion of the second conductive member is exposed from the second main surface of the resin sealing member.    
     
     
         35 . A semiconductor device according to  claim 34 , wherein the second portion of the first conductive member is exposed from side faces of the resin sealing member.  
     
     
         36 . A semiconductor device according to  claim 34 , wherein the second connecting means is a salient electrode or an electrically conductive adhesive.  
     
     
         37 . A semiconductor device according to  claim 34 , 
 wherein the first electrode of the semiconductor chip is a drain electrode, and    wherein the second electrode of the semiconductor chip is a source electrode.    
     
     
         38 . A semiconductor device according to  claim 34 , 
 wherein the first electrode of the semiconductor chip is a source electrode, and    wherein the second electrode of the semiconductor chip is a drain electrode.    
     
     
         39 . A method of manufacturing a semiconductor device comprising: 
 a semiconductor chip having first and second main surfaces positioned on mutually opposite sides, a first electrode formed over the first main surface, and a second electrode formed over the second main surface;    a resin sealing member sealing the semiconductor chip and having first and second main surfaces positioned on mutually opposite sides, the first main surface being positioned on the first main surface side of the semiconductor chip, and the second main surface being positioned on the second main surface side of the semiconductor chip;    a first conductive member having a first portion, a second portion, and a third portion, the first portion being connected to the first electrode of the semiconductor chip through a first connecting means, the second portion being formed integrally with the first portion, and the third portion being formed integrally with the second portion and positioned on the second main surface side of the resin sealing member relative to the first portion; and    a second conductive member having a first portion connected to the second electrode of the semiconductor chip through a second connecting means and a second conductive member formed integrally with the first portion and larger in thickness than the first portion,    wherein resin is injected into a cavity of a molding die in such a manner that the first portion of the first conductive member is exposed from the first main surface of the resin sealing member, the second portion of the first conductive member is positioned in the interior of the resin sealing member, and the third portion of the first conductive member and the second conductive member are exposed from the second main surface of the resin sealing member, thereby to form the resin sealing member.    
     
     
         40 . An electronic device comprising a wiring substrate, a semiconductor device mounted over the wiring substrate, and a heat dissipating member disposed over the semiconductor device, the semiconductor device comprising: 
 a semiconductor chip having first and second main surfaces positioned on mutually opposite sides, first and second electrodes formed over the first main surface, and a third electrode formed over the second main surface;    a resin sealing member sealing the semiconductor chip and having first and second main surfaces positioned on mutually opposite sides, the first main surface being positioned on the first main surface side of the semiconductor chip, and the second main surface being positioned on the second main surface side of the semiconductor chip;    a first conductive member having a first portion, a second portion, and a third portion, the first portion being connected to the first electrode of the semiconductor chip through a first connecting means and exposed from the first main surface of the resin sealing member, the second portion being formed integrally with the first portion, and the third portion being formed integrally with the second portion and exposed from the second main surface of the resin sealing member;    a second conductive member having a first portion, a second portion, and a third portion, the first portion being connected to the second electrode of the semiconductor chip through a second connecting means and positioned in the interior of the resin sealing member, the second portion being formed integrally with the first portion, and the third portion being formed integrally with the second portion and exposed from the second main surface of the resin sealing member; and    a third conductive member connected to the third electrode of the semiconductor chip through a third connecting means and exposed from the second main surface of the resin sealing member,    wherein the third portions of the first and second conductive members, as well as the third conductive member, are soldered to electrodes formed over the wiring substrate, and    wherein the first portion of the first conductive member is connected to the heat dissipating member through a heat conducting member.    
     
     
         41 . An electronic device according to  claim 40 , 
 wherein the heat conducting member is formed of a solder material, and    wherein the first portion of the first conductive member is fixed to the heat dissipating member through the solder material.