Methods using a peroxide-generating compound to remove group VIII metal-containing residue

Abstract

A method for cleaning substrates to remove Group VIII metal-containing, particularly platinum-containing, residue using a cleaning composition that includes a peroxide-generating compound.

1 - 30 . (canceled)  
   
   
       31 . A method of cleaning processing equipment, the method comprising: 
 providing processing equipment comprising a planarization surface comprising Group VIII metal-containing residue; and    contacting the planarization surface with a cleaning composition comprising a peroxide-generating compound to remove at least a portion of the Group VIII metal-containing residue.    
   
   
       32 . The method according to  claim 31 , wherein the planarization surface is selected from the group consisting of an abrasive pad and a polishing pad.  
   
   
       33 . The method according to  claim 31 , wherein the Group VIII metal-containing residue comprises platinum-containing residue.  
   
   
       34 . The method according to  claim 33 , wherein the platinum-containing residue comprises a platinum alloy.  
   
   
       35 . The method according to  claim 31 , wherein the peroxide-generating compound is H 2 O 2  or an organic peroxide.  
   
   
       36 . The method according to  claim 35 , wherein the peroxide-generating compound is present in an amount of at least about 0.1% by weight.  
   
   
       37 . The method according to  claim 35 , wherein the peroxide-generating compound is present in an amount of no greater than about 5% by weight.  
   
   
       38 . The method according to  claim 31 , wherein the cleaning composition is at a temperature of no greater than about 60° C.  
   
   
       39 . The method according to  claim 31 , wherein the cleaning composition has a pH of at least 3.  
   
   
       40 . The method according to  claim 31 , wherein the cleaning composition has a pH of no greater than 13.  
   
   
       41 . A method of cleaning processing equipment, the method comprising: 
 providing processing equipment comprising a planarization surface comprising platinum-containing residue; and    contacting the planarization surface with a cleaning composition comprising a peroxide-generating compound to remove at least a portion of the platinum-containing residue.    
   
   
       42 . The method according to  claim 41 , wherein the peroxide-generating compound is H 2 O 2 .  
   
   
       43 . The method according to  claim 41 , wherein the platinum-containing residue comprises a platinum alloy.  
   
   
       44 . The method according to  claim 43 , wherein the platinum alloy comprises Pt/Ir or Pt/Rh.  
   
   
       45 . The method according to  claim 41 , wherein the cleaning composition is at a temperature of no greater than about 60° C.  
   
   
       46 . A method of cleaning processing equipment, the method comprising: 
 providing processing equipment comprising a planarization surface comprising platinum-containing residue; and    contacting the planarization surface with a cleaning composition comprising H 2 O 2  at a pH of 3 to 13 and a temperature of no greater than about 60° C. to remove at least a portion of the platinum-containing residue.