Blends of high temperature resins suitable for fabrication using powdered metal or compression molding techniques
Abstract
The invention relates to a resin blend comprising at least two dry blended, non-melt processible resin particulates, wherein the at least two dry blended, non-melt processible resin particulates are molded by compression molding. The invention also relates to a process for producing a resin blend comprising mixing at least two non-melt processible resin particulates by dry blending and molding the mixture by compression molding. Another aspect of the invention is a resin blend comprising at least two blended, non-melt processible polyimide resin particulates, wherein the at least two blended, non-melt processible resin particulates are molded by compression molding.
Claims
exact text as granted — not AI-modified1 . A resin blend comprising at least two dry blended, non-melt processible resin particulates, wherein the at least two dry blended, non-melt processible resin particulates are molded by compression molding.
2 . The resin blend of claim 1 having a moisture pickup level less than an expected moisture pickup level of the at least two dry blended, non-melt processible resin particulates.
3 . The resin blend of claim 1 or 2 , wherein at least one dry blended, non-melt processible resin particulate is a polyimide resin particulate.
4 . The resin blend of claim 3 , wherein the polyimide resin particulate is present in an amount of from about 5 weight percent to about 95 weight percent of the total resin blend.
5 . The resin blend of claim 1 or 2 , wherein the at least two dry blended, non-melt processible resin particulates are polyimide resin particulates.
6 . The resin blend of claim 1 or 2 , wherein the at least two dry blended, non-melt processible resin particulates have an average particle size of from about 5 μm to about 500 μm.
7 . The resin blend of claim 1 or 2 , further comprising at least one encapsulated filler.
8 . The resin blend of claim 7 , wherein the at least one encapsulated filler is present in an amount of from about 1 weight percent to about 70 weight percent of the total resin blend.
9 . The resin blend of claim 1 or 2 , further comprising at least one unencapsulated filler.
10 . The resin blend of claim 9 , wherein the at least one unencapsulated filler is present in an amount of from about 1 weight percent to about 15 weight percent of the total resin blend.
11 . A compression molded article comprising the resin blend of any of claims 1 - 10 .
12 . A method of producing a compression molded article comprising:
(a) mixing at least two non-melt processible resin particulates by dry blending; and (b) molding the mixture of step (a) by compression molding.
13 . The method of claim 12 , wherein at least one non-melt processible resin particulate is a polyimide resin particulate.
14 . The method of claim 12 , wherein the at least two non-melt processible resin particulates are polyimide resin particulates.
15 . The method of claim 12 further comprising the step of adding at least one filler.
16 . A compression molded article produced by the method of claim 12 .
17 . A resin blend comprising at least two blended, non-melt processible polyimide resin particulates, wherein the at least two blended, non-melt processible polyimide resin particulates are molded by compression molding.
18 . A compression molded article comprising the resin blend of claim 17.Join the waitlist — get patent alerts
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