Multichip semiconductor package

Abstract

A multichip semiconductor package and method of making is provided that has a plurality of semiconductor chips fabricated in electrical isolation one from another integrally on a singular coextensive substrate useful for numerous and varied semiconductor chip applications. The semiconductor chips, instead of being singulated into a plurality of single-chip packages, are kept as integrally formed together and are thereafter electrically connected together so as to form a larger circuit. Encapsulation follows so as to form a single, multichip package. Common signals of the plurality of semiconductor chips are bussed together in electrical common across the substrate to a common electrode suitable for electrically providing the signal to another, external circuit, such as a PWB. The common bussing is achieved by conductive leads disposed across the substrate in pair sets having an extended portion that accommodates the common electrode in contact therewith. The common electrode contacts the conductive lead through an opening formed in the encapsulant that surrounds the substrate. The extended portions of each conductive lead are staggered with respect to the extended portion of the conductive lead in the same, or juxtaposed, pair set. In this manner, multiple electrodes are available for close proximity positioning while, simultaneously, avoiding electrical shorts amongst the pair sets.

1 - 20 . (canceled)  
     
     
         21 . An apparatus for supporting a microelectronic substrate, comprising: 
 a support member having a support surface configured to carry a microelectronic substrate;    a first connection structure carried by the support member and configured to remain decoupled from the microelectronic substrate when the support member carries the microelectronic substrate, the first connection structure having a first bond site configured to receive a flowable conductive material, the first connection structure further having a first number of first elongated members connected to and extending outwardly from the first bond site, wherein none of the first elongated members is configured to be electrically connected to the microelectronic substrate; and    a second connection structure carried by the support member, the second connection structure having a second bond site configured to receive a flowable conductive material, the second connection structure being configured to be coupled to the microelectronic substrate when the support member carries the microelectronic substrate, the second connection structure further having a second number of second elongated members extending outwardly from the second bond site, the second number being the same as the first number.    
     
     
         22 . The apparatus of  claim 21  wherein each of the first elongated members is configured to receive at least a portion of the flowable conductive material and wherein each of the second elongated members is configured to receive at least a portion of the flowable conductive material.  
     
     
         23 . The apparatus of  claim 21  wherein the second connection structure has a third bond site configured to be wire bonded to the microelectronic substrate when the microelectronic substrate is carried by the support member, and wherein at least one of the second elongated members extends between the second and third bond sites.  
     
     
         24 . The apparatus of  claim 21  wherein the first conductive structure includes two first elongated members extending away from opposite sides of the first bond site.  
     
     
         25 . The apparatus of  claim 21  wherein the first connection structure includes at least one electrically conductive metallic material.  
     
     
         26 . The apparatus of  claim 21  wherein one of the first elongated members is shorter than another of the first elongated members.  
     
     
         27 . The apparatus of  claim 21  wherein the first bond site includes a solder ball pad, and wherein the apparatus further comprises a solder ball disposed on the solder ball pad.  
     
     
         28 . The apparatus of  claim 21 , further comprising: 
 a first solder ball disposed on the first bond site and having a first size and shape;    a second solder ball disposed on the second bond site and having a second size at least approximately the same as the first size, and a second shape at least approximately the same as the first shape; and    a microelectronic substrate carried by the support member, the microelectronic substrate being electrically coupled to the second connection structure and being electrically isolated from the first connection structure.    
     
     
         29 . The apparatus of  claim 21  wherein the first connection structure and the second connection structure each have two elongated members.  
     
     
         30 . The apparatus of  claim 21  wherein each of the first and second elongated members has an axis along which the member is elongated and wherein each member has a width transverse to the axis, further wherein the widths of all the elongated members on the support member are approximately equal.  
     
     
         31 . The apparatus of  claim 21 , further comprising: 
 a first solder ball disposed on the first bond site and projecting away from the first bond site by a first distance; and    a second solder ball disposed on the second bond site and projecting away from the second bond site by a second distance at least approximately the same as the first distance.    
     
     
         32 . An apparatus for supporting a microelectronic substrate, comprising: 
 a support member having a support surface configured to carry a microelectronic substrate;    a first bond site carried by the support member and configured to remain decoupled from the microelectronic substrate when the support member carries the microelectronic substrate;    first elongated members connected to and extending outwardly from the first bond site;    a first portion of a flowable conductive material disposed on the first bond site, the first portion of the flowable conductive material projecting from the first bond site in a direction generally normal to the first bond site by a first distance;    a second bond site carried by the support member and configured to be electrically coupled to the microelectronic substrate when the support member carries the microelectronic substrate;    second elongated members extending outwardly from the second bond site; and    a second portion of a flowable conductive material disposed on the second bond site, the second portion of the flowable conductive material projecting from the second bond site in a direction generally normal to the second bond site by a second distance at least approximately equal to the first distance.    
     
     
         33 . The apparatus of  claim 32  wherein the first bond site has a total of a first number of first elongated members and the second bond site has a total of a second number of second elongated members, and wherein the first number is the same as the second number.  
     
     
         34 . The apparatus of  claim 32 , further comprising a third bond site configured to be wire bonded to the microelectronic substrate when the microelectronic substrate is carried by the support member, and wherein at least one of the second elongated members extends between the second and third bond sites.  
     
     
         35 . The apparatus of  claim 32  wherein at least part of the first portion of the flowable conductive material extends along the first elongated members, and wherein at least part of the second portion of the flowable conductive material extends along the second elongated members.  
     
     
         36 . The apparatus of  claim 32  wherein the first elongated members include two first elongated members extending away from opposite sides of the first bond site.  
     
     
         37 . The apparatus of  claim 32  wherein the first elongated members include at least one electrically conductive metallic material.  
     
     
         38 . The apparatus of  claim 32  wherein the first bond site includes a solder ball pad, and wherein the flowable conductive material includes a solder ball disposed on the solder ball pad.  
     
     
         39 . The apparatus of  claim 32 , further comprising: 
 a first solder ball disposed on the first bond site;    a second solder ball disposed on the second bond site; and    a microelectronic substrate carried by the support member, the microelectronic substrate being electrically coupled to the second bond site and being electrically isolated from the first bond site.    
     
     
         40 . A microelectronic assembly, comprising: 
 a microelectronic substrate;    a support member carrying the microelectronic substrate; and    a connection structure carried by the support member, the connection structure having a bond site configured to receive a flowable conductive material, the connection structure further having at least two elongated members connected to and extending outwardly from the bond site with none of the elongated members being electrically coupled to the microelectronic substrate.    
     
     
         41 . The assembly of  claim 40  wherein each elongated member is configured to receive at least a portion of the flowable conductive material from the bond site.  
     
     
         42 . The assembly of  claim 40  wherein the connection structure is a first connection structure and the elongated members are first elongated members configured to receive at least a portion of a flowable conductive material from the first bond site, and wherein the apparatus further comprises a second connection structure carried by the support member, the second connection structure having a second bond site configured to receive a flowable conductive material, the second connection structure being electrically coupled to the microelectronic substrate and having second elongated members extending outwardly from the second bond site, wherein each of the second elongated members is configured to receive at least a portion of the flowable conductive material from the second bond site.  
     
     
         43 . The assembly of  claim 40  wherein the connection structure is a first connection structure and the elongated members are first elongated members, and wherein the apparatus further comprises a second connection structure carried by the support member, the second connection structure having a second bond site configured to receive a flowable conductive material, the second connection structure having a third bond site electrically coupled to the microelectronic substrate, the second connection structure further having second elongated members extending outwardly from the second bond site, wherein each of the second elongated members is configured to receive at least a portion of the flowable conductive material from the second bond site, and wherein at least one of the second elongated members extends between the second and third bond sites.  
     
     
         44 . The assembly of  claim 40  wherein the conductive structure includes exactly two elongated members extending away from opposite sides of the bond site.  
     
     
         45 . The assembly of  claim 40  wherein the connection structure includes at least one electrically conductive metallic material.  
     
     
         46 . The assembly of  claim 40  wherein the bond site includes a solder ball pad, and wherein the apparatus further comprises a solder ball disposed on the solder ball pad.  
     
     
         47 . The apparatus of  claim 40  wherein the connection structure is a first connection structure and the elongated members are first elongated members configured to receive at least a portion of a flowable material from the first bond site, and wherein the apparatus further comprises a second connection structure carried by the support member, the second connection structure having a second bond site configured to receive a flowable conductive material, the second connection structure being electrically coupled to the microelectronic substrate and having second elongated members extending outwardly from the second bond site, wherein each of the second elongated members is configured to receive at least a portion of the flowable conductive material from the second bond site, and wherein the apparatus further comprises: 
 a first solder ball disposed on the first bond site and projecting away from the first bond site by a first distance; and    a second solder ball disposed on the second bond site and projecting away from the second bond site by a second distance at least approximately the same as the first distance.