Hybrid integrated circuit device and method of manufacturing the same

Abstract

A method of manufacturing a hybrid integrated circuit device of the present invention includes the steps of preparing a lead frame which constituted by units each having a plurality of leads, and fixing a circuit substrate on each unit of the lead frame by fixing pads which are formed on the surface of the circuit substrate to the leads, where a space between a first pad which is formed at an end edge of the circuit substrate and a second pad which is adjacent to the first pad is set narrower than a space between the pads themselves.

1 . A hybrid integrated circuit device comprising: 
 a circuit substrate;    a plurality of pads arranged along a side surface of the circuit substrate; and    leads fixed to the pads,    wherein a space between a first pad which is formed at an end edge of the circuit substrate and a second pad which is adjacent to the first pad is set narrower than a space between the other pads themselves.    
     
     
         2 . The hybrid integrated circuit device according to  claim 1 , wherein the pads and the leads are fixed to each other with soft solder.  
     
     
         3 . The hybrid integrated circuit device according to  claim 1 , wherein any one of the first and second pads is a dummy pad.  
     
     
         4 . A method of manufacturing a hybrid integrated circuit device comprising: 
 preparing a lead frame which is constituted by units each having a plurality of leads; and    fixing a circuit substrate on each unit of the lead frame by fixing pads formed on a surface of the circuit substrate to the leads,    wherein a space between a first pad which is formed at an end edge of the circuit substrate and a second pad which is adjacent to the first pad is set narrower than a space between the other pads themselves.    
     
     
         5 . The method according to  claim 4 , wherein the pads are arranged along a side edge of the circuit substrate.  
     
     
         6 . The method according to  claim 4 , wherein the pads are arranged along opposite side edges of the circuit substrate.  
     
     
         7 . The method according to  claim 4 , wherein any one of the first and second pads is a dummy pad.  
     
     
         8 . The method according to  claim 4 , wherein the fixing of the leads and the pads to each other is performed with brazing material.  
     
     
         9 . The method according to  claim 4 , wherein the circuit substrate is fixed on the lead frame after forming an electric circuit constituted by a conductive pattern and a circuit element on the surface of the circuit substrate.  
     
     
         10 . The method according to  claim 4 , wherein an electric circuit formed on the surface of the circuit substrate is sealed after fixing the circuit substrate on the lead frame.