Polishing composition and polishing method

Abstract

A polishing composition contains alumina, a complexing agent, and an oxidizing agent. It is preferable that the complexing agent is at least one compound selected from an α-amino acid, ammonia, and an ammonium salt. The polishing composition is preferably used in applications for polishing an object having a resin section with a trench, and a conductor layer provided on the resin section so that at least the trench is filled with the conductor layer.

1 . A polishing composition for use in an application for polishing an object having a resin section with a trench, and a conductor layer provided on the resin section so that at least the trench is filled with the conductor layer, the polishing composition comprising alumina, a complexing agent, and an oxidizing agent.  
     
     
         2 . The polishing composition according to  claim 1 , wherein the resin section is a resin layer provided on a substrate.  
     
     
         3 . The polishing composition according to  claim 1 , wherein the complexing agent is at least one compound selected from an α-amino acid, ammonia, and an ammonium salt.  
     
     
         4 . The polishing composition according to  claim 1 , wherein the complexing agent is an α-amino acid and at least one compound selected from between ammonia and an ammonium salt.  
     
     
         5 . The polishing composition according to  claim 4 , wherein content of an α-amino acid in the polishing composition is 0.01 to 20 mass %.  
     
     
         6 . The polishing composition according to  claim 4 , wherein sum of content of ammonia and an ammonium salt in the polishing composition is 0.1 to 10 mass %.  
     
     
         7 . The polishing composition according to  claim 1 , further comprising alumina sol.  
     
     
         8 . The polishing composition according to  claim 1 , wherein a pH of the polishing composition is 7 or more.  
     
     
         9 . A polishing composition for use in an application for polishing an object to be polished so as to form conductor wiring for a wiring board, wherein the object has an insulating resin section with a trench, and a copper conductor layer provided on the resin section so that at least the trench is filled with the conductor layer, the polishing composition comprising alumina, at least one compound selected from between ammonia and an ammonium salt, an α-amino acid, an oxidizing agent, and water.  
     
     
         10 . A polishing method comprising: 
 preparing a polishing composition including alumina, a complexing agent, and an oxidizing agent; and    polishing an object having a resin section with a trench, and a conductor layer provided on the resin section so that at least the trench is filled with the conductor layer, by using the prepared polishing composition.