Polishing composition and polishing method

Abstract

A polishing composition includes an abrasive, phosphoric acid, and an oxidizing agent and has a pH of 6 or less. The polishing composition has the capability for polishing an alloy containing nickel and iron with a high stock removal rate. Accordingly, the polishing composition is preferably used in an application for polishing an object including the alloy containing nickel and iron.

1 . A polishing composition for use in an application for polishing an object including an alloy containing nickel and iron, the polishing composition comprising an abrasive, phosphoric acid, and an oxidizing agent, and having a pH of 6 or less.  
     
     
         2 . The polishing composition according to  claim 1 , wherein the object is provided with a magnetic layer formed of an alloy containing nickel and iron, and the polishing composition is used in an application for polishing the object for the purpose of forming a wired structure.  
     
     
         3 . The polishing composition according to  claim 1 , wherein the phosphoric acid is at least one compound selected from the group consisting of orthophosphoric acid, polyphosphoric acid, pyrophosphoric acid, metaphosphoric acid, and hexametaphosphoric acid.  
     
     
         4 . The polishing composition according to  claim 1 , wherein content of phosphoric acid in the polishing composition is 0.1 to 1.0 mass %.  
     
     
         5 . The polishing composition according to  claim 1 , further comprising a corrosion inhibitor.  
     
     
         6 . The polishing composition according to  claim 5 , wherein the corrosion inhibitor is benzotriazol or a derivative thereof.  
     
     
         7 . The polishing composition according to  claim 1 , further comprising a water-soluble polymer.  
     
     
         8 . The polishing composition according to  claim 7 , wherein the water-soluble polymer is a polyvinyl alcohol.  
     
     
         9 . A polishing composition for use in an application for polishing an object to be polished for the purpose of forming the wired structure for a semiconductor device, wherein the object has an insulator layer with a trench, a magnetic layer of an alloy containing nickel and iron arranged on the insulator layer, and a conductor layer arranged on the magnetic layer, the polishing composition comprising an abrasive, phosphoric acid, an oxidizing agent, a corrosion inhibitor, a water-soluble polymer, and water, and having a pH of 6 or less.  
     
     
         10 . A polishing method comprising: 
 preparing a polishing composition which includes an abrasive, phosphoric acid, and an oxidizing agent and having a pH of 6 or less; and    polishing an object including an alloy containing nickel and iron, by using the prepared polishing composition.