US2005202763A1PendingUtilityA1

Multi-function slurry delivery system

Priority: Mar 9, 2004Filed: Mar 9, 2004Published: Sep 15, 2005
Est. expiryMar 9, 2024(expired)· nominal 20-yr term from priority
B24B 57/02B24B 37/044
34
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Claims

Abstract

A method and system for delivering a mixed slurry for use chemical mechanical polishing operation. A first slurry may be mixed with a second slurry to provide a mixed slurry thereof. A flow rate and a mixing ratio associated with the mixed slurry can be controlled to provide an accurate flow rate control and adjustable mixing ratio thereof. The first slurry and the second slurry may be mixed in-line utilizing an in-line mixing mechanism to provide a mixed slurry thereof. Alternatively, the first and second slurries may be pre-mixed utilizing a pre-mixing mechanism to provide a mixed slurry there.

Claims

exact text as granted — not AI-modified
1 . A method for delivering a mixed slurry for use in a chemical mechanical polishing operation, said method comprising the steps of: 
 delivering a first slurry for use in a chemical mechanical polishing operation;    mixing said first slurry with a second slurry to provide a mixed slurry thereof; and    controlling a flow rate and a mixing ratio associated with said mixed slurry, thereby providing an accurate control of said flow rate and adjustable mixing ratios thereof for use in enhancing chemical mechanical polishing operations utilized in the fabrication of semiconductor devices.    
   
   
       2 . The method of  claim 1  wherein the step of mixing said first slurry with said second slurry to provide a mixed slurry, further comprises the step of: 
 mixing said first slurry with said second slurry in-line to provide a mixed slurry thereof.    
   
   
       3 . The method of  claim 2  further comprising the step of adjusting said mixing ratio by controlling said flow rate.  
   
   
       4 . The method of  claim 1  wherein the step of mixing said slurry with said second slurry, further comprises the step of: 
 pre-mixing said first slurry with said second slurry to provide a mixed slurry thereof.    
   
   
       5 . The method of  claim 4  further comprising the step of: 
 adjusting said mixing ratio by measuring a weight of said first slurry.    
   
   
       6 . The method of  claim 4  further comprising the step of: 
 adjusting said mixing ratio by adjusting a weight of said second slurry.    
   
   
       7 . The method of  claim 4  further comprising the steps of: 
 adjusting said mixing ratio by adjusting a weight of said first slurry and a weight of said second slurry.    
   
   
       8 . The method of  claim 4  further comprising the steps of: 
 pre-mixing said first slurry and said second slurry in a pre-mixing tank to provide said mixed slurry, wherein said pre-mixing tank is associated with at least one load cell to control said mixing ratio;    controlling said flow rate of said mixed slurry delivered from said pre-mixing tank to a chemical mechanical polishing device utilizing a slurry pump associated with said-pre-mixing tank; and    thereafter delivering said mixed slurry to said chemical mechanical polishing device.    
   
   
       9 . The method of  claim 1  wherein the step of mixing said slurry with said second slurry, further comprises the step of: 
 mixing said first slurry with said second slurry in-line to provide a mixed slurry thereof; and    pre-mixing said first slurry with said second slurry to provide a mixed slurry thereof.    
   
   
       10 . The method of  claim 1  further comprising the step of: 
 delivering said first slurry from a first supply tank linked to at least one circulation pump, wherein said circulation pump is operable in association with at least one slurry pump; and    delivering said second slurry from a second supply tank connected to at least one circulation pump, wherein said second supply tank is operable in association with at least one slurry pump; and    wherein said first and second supply tanks are operable in association with at least one valve.    
   
   
       11 . A system for delivering a slurry for use in a chemical mechanical polishing operation, said system comprising: 
 a first slurry for use in a chemical mechanical polishing operation;    a mixing mechanism for mixing said first slurry with a second slurry to provide a mixed slurry thereof; and    a control mechanism for controlling a flow rate and a mixing ratio associated with said mixed slurry, thereby providing an accurate control of said flow rate and adjustable mixing ratios thereof for use in enhancing chemical mechanical polishing operations utilized in the fabrication of semiconductor devices.    
   
   
       12 . The system of  claim 11  wherein said mixing mechanism further comprises: 
 in-line mixing mechanism for mixing said first slurry with said second slurry in-line to provide a mixed slurry thereof.    
   
   
       13 . The system of  claim 12  wherein said control mechanism permits said mixing ratio to be adjusted by controlling said flow rate.  
   
   
       14 . The system of  claim 11  wherein said mixing mechanism further comprises: 
 a pre-mixing mechanism for pre-mixing said first slurry with said second slurry to provide a mixed slurry thereof.    
   
   
       15 . The system of  claim 14  wherein said mixing ratio is adjustable by measuring a weight of said first slurry.  
   
   
       16 . The system of  claim 14  wherein said mixing ratio is adjustable by measuring a weight of said second slurry.  
   
   
       17 . The system of  claim 14  wherein said mixing ratio is adjustable by adjusting a weight of said first slurry and a weight of said second slurry.  
   
   
       18 . The system of  claim 14  wherein: 
 said pre-mixing mechanism further comprises a pre-mixing tank for pre-mixing said first slurry and said second slurry to provide said mixed slurry, such that said pre-mixing tank is associated with at least one load cell to control said mixing ratio; and    said flow rate of said mixed slurry delivered from said pre-mixing tank to a chemical mechanical polishing device is controllable utilizing a slurry pump associated with said-pre-mixing tank.    
   
   
       19 . The system of  claim 11  wherein said mixing mechanism further comprises: 
 in-line mixing mechanism for mixing said first slurry with said second slurry in-line to provide a mixed slurry thereof; and    pre-mixing mechanism for pre-mixing said first slurry with said second slurry to provide a mixed slurry thereof.    
   
   
       20 . The system of  claim 11  wherein said delivery mechanism further comprises: 
 a first supply tank for delivering said first slurry, wherein said first supply tank is linked to at least one circulation pump, such that said circulation pump is operable in association with at least one slurry pump;    a second supply tank for delivering said second slurry, wherein said second supply tank is connected to at least one circulation pump, such that said second supply tank is operable in association with at least one slurry pump; and    wherein said first and second supply tanks are operable in association with at least one valve.

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