High-speed TO-can optoelectronic packages

Abstract

Methods and apparatus that provide TO-can optoelectronic packages suitable for optical telecommunications applications involving data speed rates of up to 10 Gbps and beyond. A TO-can optoelectronic package may comprise a TO-can cap and a TO-can header defining an interior region of the package. An optoelectronic component such as a laser or photodetector can be mounted within the interior region of the TO-can. An electrical connection may be selected for coupling the optoelectronic component to a selected post of the TO-can package. The electrical connection may include a transmission line formed from a conductive element other than a bond wire having a predefined length that can assist in reducing parasitic effects within the TO-can optoelectronic package to accommodate high-speed data rates. The transmission line itself is connected to the optoelectronic component and the selected post with a plurality of bond wires.

1 . A high-speed TO-can package comprising: 
 a TO-can cap and a TO-can header defining an interior region;    a plurality of posts connected to the TO-can header;    a laser mounted within the interior region; and    an electrical connection coupling the laser and a selected post, wherein the electrical connection includes a transmission line formed from a conductive element other than a bond wire having a predefined length for reducing parasitic effects within the TO-can package to be able to accommodate high-speed data rates, and wherein the transmission line itself is connected to the laser and the selected post with a plurality of bond wires.    
     
     
         2 . A high-speed TO-can package comprising: 
 a TO-can cap and a TO-can header defining an interior region;    a plurality of posts connected to the TO-can header;    a photodetector mounted in the interior region; and    an electrical connection coupling the photodetector and a selected post, wherein the electrical connection includes a transmission line formed from a conductive element other than a bond wire having a predefined length for reducing parasitic effects within the TO-can package to be able to accommodate high-speed data rates, and wherein the transmission line itself is connected to the photodetector and the selected post with a plurality of bond wires.    
     
     
         3 . A TO-can optoelectronic package comprising: 
 a TO-can cap and a TO-can header defining an interior region of the package;    an optoelectronic component mounted within the interior region;    a plurality of posts for connection to a circuit board; and    an electrical connection coupling the optoelectronic component and a selected post, wherein the electrical connection includes a transmission line formed from a conductive element other than a bond wire having a predefined length for reducing parasitic effects within the TO-can optoelectronic package to be able to accommodate high-speed data rates, and wherein the transmission line itself is connected to the optoelectronic component and the selected post with a plurality of bond wires.