Semiconductor chip and fabrication method thereof

Abstract

A semiconductor chip and a fabrication method thereof are disclosed. In the fabrication method, isotropic etching and anisotropic etching are performed on a cutting portion of a semiconductor wafer to form grooves in the semiconductor wafer. Through these grooves, the semiconductor wafer can be diced with no use of any dicing blade. In addition, it is possible to form semiconductor chips whose edges and corners are rounded off. According to the fabrication method, fabrication time can be shorten. In addition, it is possible to improve integration and yield of semiconductor chip formation.

1 . A semiconductor chip fabricated from a semiconductor wafer, comprising: 
 a first surface supporting a semiconductor element; and    a second surface opposite the first surface,    wherein at least one of the first surface and the second surface has rounded-off edges.    
   
   
       2 . The semiconductor chip as claimed in  claim 1 , further comprising notched side surfaces.  
   
   
       3 . A semiconductor chip fabricated from a semiconductor wafer, comprising: 
 a plurality of rounded-off corners.