Integrated sensor and electronics package

Abstract

An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input/output connections on the package substrate are electrically connected to one or more of the electronic chips.

1 . An inertial measurement system comprising: 
 a printed circuit board; and    one or more integrate sensor and electronics packages mounted to the printed circuit board, each integrated sensor package including: 
 a package substrate,  
 a microelectromechanical sensor die bonded to one side of the package substrate,  
 one or more electronic chips bonded to an opposite side of the package substrate,  
 internal electrical connections running from the sensor die, through the package substrate and to the one or more electronic chips, and  
 input/output connections on the package substrate electrically connected to one or more of the electronic chips and to the printed circuit board.  
   
   
   
       2 . The system of  claim 1  in which the sensors are configured as in-plane sensors.  
   
   
       3 . The system of  claim 1  in which at least one sensor is an out-of-plane sensor.  
   
   
       4 . The system of  claim 1  in which there are at least three said integrated packages, two having sensors configured as in-plane sensors and one configured as an out-of-plane sensor.  
   
   
       5 . The system of  claim 1  in which the package substrate is made of a high temperature co-fired ceramic material or a low temperature co-fired ceramic material.  
   
   
       6 . The system of  claim 1  in which the package substrate is a laminate structure.  
   
   
       7 . The system of  claim 1  further including a cavity in the substrate, the sensor die located in the cavity.  
   
   
       8 . The system of  claim 1  in which the sensor die includes: 
 a sensor substrate,    a microelectromechanical structure machined from the substrate, and    a cap secured to the sensor substrate covering the microelectromechanical structure.    
   
   
       9 . The system of  claim 8  in which the cap includes electrical connections therethrough.  
   
   
       10 . The system of  claim 8  in which the cap is attached to the package substrate.  
   
   
       10 . The system of  claim 8  in which the sensor substrate is bonded to the package substrate.  
   
   
       11 . The system of  claim 8  in which the microelectromechanical structure is configured as a gyroscope or accelerometer.  
   
   
       12 . The system of  claim 1  in which there are at least two electronic chips, an application specific integrated circuit chip for controlling the microelectromechanical sensor die and a digital gate array chip for processing the output of the application specific integrated circuit chip.  
   
   
       13 . The system of  claim 12  in which the application specific integrated circuit chip is bonded to the package substrate and the digital gate array chip is bonded to the application specific integrated circuit chip.  
   
   
       14 . The system of  claim 13  in which the digital gate array chip is wire bonded to the application specific integrated circuit chip and the application specific integrated circuit chip is wire bonded to the package substrate.  
   
   
       15 . The system of  claim 12  further including at least one de-coupling capacitor chip mounted on the package substrate for buffering signals to and from the application specific integrated circuit chip.  
   
   
       16 . The system of  claim 15  in which the de-coupling capacitor chip is a surface mount chip.  
   
   
       17 . The system of  claim 1  in which the input/output connections are solder balls.  
   
   
       18 . The system of  claim 1  further including potting material encapsulating the one or more electronic chips.  
   
   
       19 . The system of  claim 1  further including a cover over the one or more electronic chips.  
   
   
       20 . The system of  claim 1  further including a shield over the microelectromechanical sensor die.  
   
   
       21 . An inertial measurement system comprising: 
 a printed circuit board; and    a plurality of integrated sensor and electronic packages mounted to the printed circuit board, each integrated package including: 
 a package substrate with a cavity on a first side thereof,  
 a microelectromechanical die sensor located in the cavity and bonded to the package substrate,  
 one or more electronic chips bonded to an opposite side of the package substrate,  
 internal electrical connections running from the sensor die, through the package substrate, and to the one or more electronic chips, and  
 input/output connections on the first side of the package substrate electrically connected to one or more of the electronic chips and to the printed circuit board.