US2005199377A1PendingUtilityA1

Heat dissipation module with heat pipes

Assignee: QUANTA COMP INCPriority: Mar 11, 2004Filed: Feb 8, 2005Published: Sep 15, 2005
Est. expiryMar 11, 2024(expired)· nominal 20-yr term from priority
H10W 40/73G06F 1/20F28D 15/02F28F 2275/04F28F 1/32
37
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A heat dissipation module including heat pipes. The heat dissipation module includes a seat with grooves, heat pipes and two fin assemblies. The heat pipes are secured in the grooves at a first end and extend at the second end thereof. A first fin assembly with parallel first fins is soldered to the seat, covering the grooves and heat pipes. A second fin assembly with parallel second fins is secured to the cantilevered end of the heat pipes.

Claims

exact text as granted — not AI-modified
1 . A heat dissipation module comprising: 
 a seat with a plurality of grooves, contacting a heat source;    a first fin assembly with a plurality of first fins disposed on the seat, covering the grooves;    a second fin assembly with a plurality of second fins disposed on a side of the first fin assembly; and    a plurality of heat pipes, each heat pipe comprising a first end disposed in the grooves, covered by the first fin assembly, and a second end extending from the grooves and passing through the second fin assembly.    
   
   
       2 . The heat dissipation module as claimed in  claim 1 , wherein the first fins are parallel.  
   
   
       3 . The heat dissipation module as claimed in  claim 1 , wherein the second first fins are parallel.  
   
   
       4 . The heat dissipation module as claimed in  claim 1 , wherein the first fins are perpendicular to the heat pipes.  
   
   
       5 . The heat dissipation module as claimed in  claim 1 , wherein the second fins are perpendicular to the heat pipes.  
   
   
       6 . The heat dissipation module as claimed in  claim 1 , wherein the heat pipes are soldered in the grooves.  
   
   
       7 . The heat dissipation module  10  as claimed in  claim 1 , wherein the first fin assembly is soldered on the seat.  
   
   
       8 . The heat dissipation module as claimed in  claim 1 , wherein the second fin assembly is soldered to the second ends of the heat pipes.  
   
   
       9 . The heat dissipation module as claimed in  claim 1 , wherein the seat, the heat pipes, the first fin assembly and the second fin assembly comprise copper or aluminum.  
   
   
       10 . A heat dissipation module comprising: 
 a seat;    a plurality of heat pipes disposed on the seat and extending from the seat, forming a plurality of cantilevered ends;    a first fin assembly with a plurality of first fins, disposed on the seat and covering the heat pipes; and    a second fin assembly with a plurality of second fins, secured at the cantilevered ends of the heat pipes.    
   
   
       11 . The heat dissipation module as claimed in  claim 10 , wherein the first fins are parallel.  
   
   
       12 . The heat dissipation module as claimed in  claim 10 , wherein the second first fins are parallel.  
   
   
       13 . The heat dissipation module as claimed in  claim 10 , wherein the first fins are perpendicular to the heat pipes.  
   
   
       14 . The heat dissipation module as claimed in  claim 10 , wherein the second fins are perpendicular to the heat pipes.  
   
   
       15 . The heat dissipation module as claimed in  claim 10 , wherein the heat pipes are soldered on the seat.  
   
   
       16 . The heat dissipation module as claimed in  claim 10 , wherein the first fin assembly is soldered on the seat.  
   
   
       17 . The heat dissipation module as claimed in  claim 10 , wherein the second fin assembly is soldered to the cantilevered ends of the heat pipes.  
   
   
       18 . The heat dissipation module as claimed in  claim 10 , wherein the seat, the heat pipes, the first fin assembly and the second fin assembly comprise copper or aluminum.

Join the waitlist — get patent alerts

Track US2005199377A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.