Heat sink

Abstract

A heat sink including a main body and a plurality of porous structures is disclosed. The main body has a plurality of hollow fins and a base. The fins and the base form a closed room. The porous structures are set on the interior surfaces of different fins, and are connected to the base. Each porous structure defines a vapor chamber.

1 . A heat sink, comprising: 
 a main body having a plurality of hollow fins and a base, the fins and the base forming a closed room; and    a plurality of porous structures set respectively on the interior surfaces of the hollow fins and connected to the base, each porous structure defining a vapor chamber.    
   
   
       2 . The heat sink as described in  claim 1 , wherein the fins are hollow and each fin has a close end and an open end facing the base.  
   
   
       3 . The heat sink as described in  claim 1 , wherein the porous structures are wicks selected from the group consisting of a combination of one or more of mesh wicks, fiber wicks, sintered wicks, and groove wicks.  
   
   
       4 . The heat sink as described in  claim 1 , wherein the porous structures contain a liquid selected from the group consisting of a mixture of one or more of inorganic compounds, water, alcohols, liquid metals, ketones, refrigerants, and organic compounds.  
   
   
       5 . The heat sink as described in  claim 1 , wherein the material of the porous structures is selected from the group consisting of a mixture of one or more of plastics, metals, alloys, and porous non-metal materials.  
   
   
       6 . The heat sink as described in  claim 1 , wherein the fins and the base are formed by a method selected from the group consisting of a combination of one or more of soldering, engaging, embedding, and adhering.  
   
   
       7 . The heat sink as described in  claim 1 , wherein the main body is one-piece molded.  
   
   
       8 . The heat sink as described in  claim 1 , wherein the fins are arranged in a longitudinal, parallel, transverse, diagonal, or irregular array.  
   
   
       9 . The heat sink as described in  claim 1 , wherein neighboring vapor chambers are communicated with each other or in fluid communication through the porous structures.  
   
   
       10 . A heat dissipating device, comprising: 
 a main body having a plurality of hollow protrusions and a base, the protrusions and the base forming a closed room; and    a plurality of porous structures set respectively on the interior surfaces of the protrusions and connected to the base, each porous structure defining a vapor chamber.    
   
   
       11 . The heat dissipating device as described in  claim 10 , wherein the protrusions are hollow and each protrusion has a close end and an open end facing the base.  
   
   
       12 . The heat dissipating device as described in  claim 10 , wherein one of the protrusions has a fin shape, columnar shape, lamellar shape, conical shape, or lump shape.  
   
   
       13 . The heat dissipating device as described in  claim 10 , wherein the porous structures are wicks.  
   
   
       14 . The heat dissipating device as described in  claim 13 , wherein the wicks are selected from the group consisting of a combination of one or more of mesh wicks, fiber wicks, sintered wicks, and groove wicks.  
   
   
       15 . The heat dissipating device as described in  claim 10 , wherein the porous structures and the main body are assembled by sintering, adhering, filling, or depositing.  
   
   
       16 . The heat dissipating device as described in  claim 10 , wherein the porous structures contain a liquid.  
   
   
       17 . The heat dissipating device as described in  claim 16 , wherein the liquid is selected from the group consisting of a mixture of one or more of inorganic compounds, water, alcohols, liquid metals, ketones, refrigerants, and organic compounds.  
   
   
       18 . The heat dissipating device as described in  claim 10 , wherein the material of the porous structures is selected from the group consisting of a mixture of one or more of plastics, metals, alloys, and porous non-metal materials.  
   
   
       19 . The heat dissipating device as described in  claim 10 , wherein the main body is one-piece molded.  
   
   
       20 . The heat dissipating device as described in  claim 10 , wherein the protrusions and the base are formed by soldering, engaging, embedding, or adhering.  
   
   
       21 . The heat dissipating device as described in  claim 10 , wherein neighboring vapor chambers are communicated with each other.  
   
   
       22 . The heat dissipating device as described in  claim 10 , wherein neighboring vapor chambers are in fluid communication through the porous structures.  
   
   
       23 . The heat dissipating device as described in  claim 10 , wherein the vapor chambers of the porous structures are arranged in the closed room in a longitudinal, parallel, transverse, diagonal, or irregular array.