Laminated fin heat sink for electronic devices

Abstract

A heat sink may transfer heat from electronic devices. A heat conductive base may have integrally attached thereto a plurality of parallel fins. The fins may be made up of two sheets of material. One sheet may be a metal having significant structural integrity and the other sheet of material may be a pyrolytic graphite material having excellent heat transfer characteristics. The two layers may be integrally bonded together.

1 . A method comprising: 
 forming a heat transfer fin of a laminate of a metallic and a non-metallic layer, said metallic layer providing structural integrity to the laminated fin.    
   
   
       2 . (canceled)  
   
   
       3 . The method of  claim 1  including permanently securing said fin to a heat conductive base using crimping.  
   
   
       4 . The method of  claim 1  including adhesively bonding said metallic and non-metallic layers.  
   
   
       5 . The method of  claim 1  wherein forming a heat transfer fin includes forming a fin of a laminate of a metallic and a pyrolytic graphite material.  
   
   
       6 . The method of  claim 1  including forming the fin with an aspect ratio higher than 20:1.  
   
   
       7 . The method of  claim 5  including forming the fin with an aspect ratio of 60:1.  
   
   
       8 . The method of  claim 1  including securing heat transfer fin to an integrated circuit.  
   
   
       9 . The method of  claim 8  including securing said heat transfer fin to a microprocessor.  
   
   
       10 . The method of  claim 2  including forming the metallic and non-metallic material of equal thicknesses.  
   
   
       11 . A heat sink comprising: 
 a heat sink fin including metallic and non-metallic materials, said metallic material providing structural integrity to said fin; and    a conductive base, said fin secured to said base.    
   
   
       12 . (canceled)  
   
   
       13 . The heat sink of  claim 11  wherein said fin is crimped to said base.  
   
   
       14 . The heat sink of  claim 11  wherein said metallic and non-metallic materials are adhesively bonded.  
   
   
       15 . The heat sink of  claim 11  wherein said non-metallic material is a pyrolytic graphite material.  
   
   
       16 . The heat sink of  claim 11  wherein the fin aspect ratio is higher than 20:1.  
   
   
       17 . The heat sink of  claim 16  wherein the fin aspect ratio is 60:1.  
   
   
       18 . The heat sink of  claim 11  wherein said base is secured to an integrated circuit.  
   
   
       19 . The heat sink of  claim 18  wherein said integrated circuit is a microprocessor.  
   
   
       20 . The heat sink of  claim 11 , said fin including a first sheet of metallic material and a second sheet of non-metallic material, said sheets being laminated together.  
   
   
       21 . The heat sink of  claim 20  wherein said first and second sheets are of equal thicknesses.  
   
   
       22 . An integrated circuit comprising: 
 an integrated circuit chip; and    a heat sink secured to said chip, said heat sink including a heat transfer fin of a laminate of metallic and non-metallic material, said metallic material providing structural integrity to said fin.    
   
   
       23 . The circuit of  claim 22  wherein said heat sink includes a conductive base, and said fin is crimped to said base.  
   
   
       24 . The circuit of  claim 22  wherein said metallic and non-metallic materials are adhesively bonded.  
   
   
       25 . The circuit of  claim 22  wherein said non-metallic material is a pyrolytic graphite material.  
   
   
       26 . The circuit of  claim 22  wherein the fin aspect ratio is higher than 20:1.  
   
   
       27 . The circuit of  claim 26  wherein the fin aspect ratio is 60:1.  
   
   
       28 . The circuit of  claim 22  wherein said heat sink includes a base secured to said integrated circuit chip.  
   
   
       29 . The circuit of  claim 28  wherein said integrated circuit chip is a microprocessor.  
   
   
       30 . The circuit of  claim 22  wherein said metallic and non-metallic material are of equal thicknesses.