US2005198749A1PendingUtilityA1
Method of making insole
Priority: Mar 10, 2004Filed: Feb 25, 2005Published: Sep 15, 2005
Est. expiryMar 10, 2024(expired)· nominal 20-yr term from priority
Inventors:Hsien-Hsiung Cheng
A43B 17/14A43B 17/006A43D 8/02
33
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Claims
Abstract
A method of making insoles has the steps of: a) Attaching a fabric layer and a bottom layer on opposite sides of foamed main member to have a substrate having a. b) Cutting the substrate to have a plurality of plates with shapes substantially like the insoles, wherein each of the plates has a top and a bottom at opposite sides and a periphery between the top and the bottom thereof. c) Cutting the peripheries of the plates to have a taper periphery respectively.
Claims
exact text as granted — not AI-modified1 . A method of making insoles, comprising the steps of:
a) preparing a substrate having a foamed main member; b) cutting the substrate to have a plurality of plates, wherein each of the plates has a top and a bottom at opposite sides and a periphery between the top and the bottom thereof, and c) removing parts of the peripheries of the plates to have a taper periphery respectively.
2 . The method as defined in claim 1 , wherein the taper periphery of insole has a portion with a width thereof greater than the rest.
3 . The method as defined in claim 1 , further comprising the step of attaching a fabric layer on the main member in the step a.
4 . The method as defined in claim 1 , further comprising the step of attaching a bottom layer on the main member in the step a, wherein the bottom layer has a friction coefficient greater than that of the main member.
5 . The method as defined in claim 1 , wherein the method of removing the periphery is cutting.
6 . The method as defined in claim 1 , wherein the method of removing the periphery is scrubbing.
7 . The method as defined in claim 1 , wherein the method of removing the periphery is grinding.
8 . A method of making insoles, comprising the steps of:
a) preparing a substrate having a foamed main member, and b) cutting the substrate to have a plurality of plates, wherein each of the plates has a taper periphery respectively.
9 . The method as defined in claim 1 , wherein the substrate is cut by laser.Join the waitlist — get patent alerts
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