US2005196527A1PendingUtilityA1
Process for manufacturing systems for conversion of water into hydrogen and sorption of hydrogen
Est. expirySep 27, 2021(expired)· nominal 20-yr term from priority
H10K 50/846H10K 59/874H01J 7/18Y10T428/12986Y10T428/12792Y10S428/917Y10T428/12806Y10T156/10Y10T428/12771
47
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Claims
Abstract
The invention teaches a system suitable for use in a water-sensitive electronic device which comprises two superimposed layers, the first material of which is formed of a material capable of sorbing hydrogen, the second material formed of a material capable of converting water into hydrogen; a screen of the type with light-emitting organic diodes comprising the system according to the invention.
Claims
exact text as granted — not AI-modified1 - 7 . (canceled)
8 . A process for manufacturing a system two superimposed layers directly contacting each other, said first layer which is formed of material capable of sorbing hydrogen, said second layer formed of a material capable of converting water into hydrogen, comprising the steps of:
preparing a substrate; depositing on said substrate a first layer of a material selected between hydrogen sorbing material and material capable of converting water into hydrogen, having also arranged on said substrate a masking element; depositing a second layer of a material selected between hydrogen sorbing material and material capable of converting water into hydrogen wherein said second layer has a different function from said material of the first layer.
9 . The process according to claim 8 wherein said material of said first layer is the hydrogen sorbing material.
10 . The process according to claim 8 wherein said same masking element used in said deposition of said first layer is used in said step of depositing the second layer of material.
11 . The process according to claim 8 wherein a second masking element having different ports from those of said masking element used in said deposition of said first layer, is used in said step of depositing said second layer of material.
12 . The process according to claim 11 wherein said second masking element has ports of larger size than said masking element used for said deposition of said first layer, such that said second layer covers completely said first layer.
13 . The process according to claim 8 wherein said substrate is one of the two supports of a screen of the type with light-emitting organic diodes.
14 . The process according to claim 8 wherein said substrate is a monoadhesive sheet.
15 . The process according to claim 14 further comprising a step of punching said monoadhesive sheet after the system according to claim 8 has been deposited on said monoadhesive sheet.
16 . The process according to claim 14 further comprising a step of punching said monoadhesive sheet before the system according to claim 8 is deposited on said monoadhesive sheet.
17 . The process according to claim 8 wherein said substrate is a biadhesive sheet.
18 . The process according to claim 17 , further comprising the steps of:
providing a biadhesive sheet comprising two sheets of protective paper; incising one sheet of protective paper along the edges of some portions thereof; removing said portions thus forming cavities; filling to the top level said cavities with a first layer of a material; arranging a masking element on said biadhesive sheet, wherein said masking element having ports encompassing said cavities filled to the top level; depositing a second layer of a material; and removing said masking element.
19 . The process according to claim 18 , further comprising a step of punching said biadhesive sheet while leaving integral said layer of protective paper opposed to that on which said system has been deposited, said punching made before the deposit of said first layer of material or after removal of said masking element.
20 . The process according to claim 17 further comprising the steps of:
providing a biadhesive sheet comprising two sheets of protective paper; incising one sheet of protective paper along the edges of some portions thereof; removing said portions thus forming cavities; incising said sheet of protective paper along the perimeter of portions encompassing said cavities; filling to the top level said cavities with a first layer of a first material; removing said paper covering said zones, so as to form openings encompassing said first layer of material; arranging a second masking element on said biadhesive sheet, said masking element having ports coinciding with said openings; depositing a second layer of a second material; and removing said masking element.
21 . The process according to claim 20 , further comprising a step of punching said biadhesive sheet while leaving integral said layer of protective paper opposed to that where said system is deposited, said punching step being carried out before said deposition of said first layer of material or after said removal of said masking element.
22 . A method comprising:
providing an OLED support; forming a hydrogen getter layer on the OLED support; forming a drier layer on the hydrogen getter layer.
23 . The method of claim 22 wherein the drier layer covers entirely the hydrogen getter layer.
24 . The method of claim 22 wherein the support includes an adhesive sheet, and wherein the hydrogen getter layer and the drier layer are formed on the adhesive sheet.
25 . A method comprising:
masking a support with a first masking element having ports of a first size; depositing a first getter layer on the support; masking the support with a second masking element having ports of a second size, wherein the ports of a second size have a larger port area than the ports of a first size; depositing a second getter layer on the first getter layer.
26 . The method of claim 25 , wherein the first getter layer includes a hydrogen getter material and the second getter layer includes a drier material.
27 . The method of claim 25 wherein the support includes an adhesive sheet.Join the waitlist — get patent alerts
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