Discrete electronic component and related assembling method

Abstract

The present invention relates to a substantially package-like discrete electronic component of the type comprising a power electronic circuit, a body or casing, substantially parallelepiped, and electric connecting pins connected inside the body with said circuit and projecting from said body for an electric connection on the electronic printed circuit board. The body has a heat dissipating header having at least one surface emerging from the body and laying on a plane whereas the pins project from the body for a first section initially extended parallel to the plane. Advantageously a pair of pins has a substantially U-shaped bending, after the first section parallel to the plane for allowing a more stable bearing of the component during the step of welding to a heat dissipating intermediate die.

1 . A substantially package-like discrete electronic component of the type comprising a power electronic circuit, a body or casing, substantially parallelepiped, and electric connecting pins connected inside the body with said circuit and projecting from said body for an electric connection on a printed circuit electronic board, said body having a heat dissipating header having at least one surface emerging from the body and laying on a plane; said pins projecting from said body for a first section initially extended parallel to said plane, characterised in that at least one of said pins has a substantially U-shaped bending, after said first section, with the base of the U tangent to said plane).  
   
   
       2 . A discrete electronic component according to  claim 1 , characterised in that the free end sections of the pins and of said at least one pin with U-shaped bending extend substantially perpendicularly to said plane in the opposite direction with respect to said header.  
   
   
       3 . A discrete electronic component according to  claim 1 , characterised in that said header and said at least one pin are tied to an intermediate die for connecting with a heat sink.  
   
   
       4 . A discrete electronic component according to  claim 1 , characterised in that it comprises two pins with U-shaped bending and in that said header and said pins are tied to an intermediate die for connecting with a heat sink.  
   
   
       5 . A discrete electronic component according to  claim 3 , characterised in that the tie is obtained by welding with alloy paste.  
   
   
       6 . A discrete electronic component according to  claim 3 , characterised in that at least three components are tied to a same intermediate die and in an adjacent position.  
   
   
       7 . A method for assembling discrete electronic components as in  claim 1  on printed circuit boards, characterised in that it comprises the following steps: 
 predisposing an intermediate die equipped with first pads defined in predetermined positions with alloy cream for welding and each conterformed at the header of said body and second pads counterformed at the base of the U-shaped bending of said at least one pin;    laying discrete components on said die with number and order corresponding to said first and second pads;    assembling, by means of automatic assembling machines, the group of the die and of the components placed thereon and transferring them into a remelting oven obtaining, by welding, a single modular element;    assembling, on a corresponding area of the electronic printed circuit board multiple modular elements by means of automatic assembling machines.    
   
   
       8 . A method according to  claim 7 , characterised in that said pads are provided to lay said components in an adjacent position with pins facing the same direction.  
   
   
       9 . A method according to  claim 7 , characterised in that said alloy paste is silk-screen printed on said die.