Electroplating system and method

Abstract

The present invention includes a method of electroplating an object, where the objects are stacked in at least one sleeve and the objects have an interior surface, that upon stacking, form a stack conduit. The sleeves are then racked to provide fluid communication between a plating solution reservoir and the stack conduit. Plating of the inner surfaces of the objects occurs by flowing an electroplating solution from the reservoir through the stack conduit in the presence of a current. The present invention also includes systems for carrying out the above method.

1 . A method of electroplating an object, comprising: 
 stacking at least two objects in at least one sleeve, wherein the objects comprise an interior surface such that upon stacking, the interior surfaces form a stack conduit;    centrally locating an in the stack conduit;    racking the at least one sleeve to provide fluid communication between a plating solution reservoir and the stack conduit;    plating the inner surfaces of the objects by flowing an electroplating solution from the reservoir through the stack conduit in the presence of a current.    
     
     
         2 . The method of  claim 1 , further comprising placing a cathode into the sleeve prior to stacking.  
     
     
         3 . The method of  claim 2 , wherein the anode is a non-corroding anode.  
     
     
         4 . The method of  claim 3 , wherein stacking further comprises placing at least one spacer into the sleeve before stacking of the objects is started or after stacking of the objects is finished.  
     
     
         5 . The method of  claim 4 , wherein centrally locating the anode further comprises placing a centering device within at least one of the spacers.  
     
     
         6 . The method of  claim 1 , wherein the stacking step further comprises stacking objects in at least 2 sleeves.  
     
     
         7 . The method of  claim 6 , wherein the stacking step further comprises stacking objects in at least 16 sleeves.  
     
     
         8 . The method of  claim 1 , wherein the stacking step further comprises stacking at least 750 objects.  
     
     
         9 . The method of  claim 1 , wherein the plating step further comprises pumping the plating solution through the stack conduit against the force of gravity.  
     
     
         10 . The method of  claim 9 , wherein the plating solution exits the stack conduit and returns to the reservoir.  
     
     
         11 . The method of  claim 1 , wherein a substantially uniform thickness metallic layer results in the absence of post-plating processing.  
     
     
         12 . The method of  claim 1 , wherein plating of the objects other than the interior surfaces is substantially avoided.  
     
     
         13 . A system for electroplating an object, comprising: 
 at least one sleeve, each adapted to receive a stack of objects, wherein each stack of objects provides a stack conduit, each sleeve comprising: 
 a sleeve inlet and a sleeve outlet,  
 a cathode located on the interior of the sleeve and outside the stack conduit, and  
 an anode centrally located in the stack conduit; and  
   a rack comprising: 
 at least one inlet for fluidly receiving an electroplating solution from a reservoir,  
 an outlet fluidly communication with the sleeve inlet to provide the electroplating solution from the rack to the stack conduit,  
 a passage fluidly connecting the at least one inlet and each outlet,  
 a cathode bar comprising a master connection point and a connection point for the cathode associated with each sleeve, and  
 an anode bar comprising a master connection point and a connection point for the anode associated with each sleeve.  
   
     
     
         14 . The system of  claim 13 , further comprising at least one spacer provided above or below the stacked objects, wherein the at least spacer comprises a center hole adapted to receive a centering device attached to the anode.  
     
     
         15 . The system of  claim 13 , wherein the anode comprises a centering device adapted to cooperate with the sleeve to center the anode within the interior of the sleeve.  
     
     
         16 . The system of  claim 13 , further comprising at least one guide rod in addition to the cathode.  
     
     
         17 . The system of  claim 13 , further comprising at least two sleeves.  
     
     
         18 . The system of  claim 17 , further comprising at least 16 sleeves.