Method for integrating heat conductor with heat dissipating fin

Abstract

A method for integrating a heat conductor with a heat dissipating fin is provided. The steps includes: a) employing a low-temperature treatment to an area of the heat conductor so as to generate a shape contraction thereof, wherein the area is a connecting area between the heat conductor and the heat dissipating fin; b) employing a heating treatment to the heat dissipating fin to generate a shape expansion thereof and opening an aperture on the heat dissipating fin corresponding to a position of the heat conductor; and c) integrating the heat conductor with the heat dissipating fin by passing the heat conductor through the aperture on the heat dissipating fin and combining the heat conductor and the heat dissipating fin under a room temperature. Accordingly, the contact density between heat conductor and heat dissipating fin is increased, while the thermal resistance is reduced.

1 . A method for integrating a heat conductor with a heat dissipating fin, comprising steps of: 
 employing a low-temperature treatment to an area of said heat conductor so as to generate a shape contraction thereof, wherein said area is a connecting area between said heat conductor and said heat dissipating fin;    employing a heating treatment to said heat dissipating fin to generate a shape expansion thereof and opening an aperture on said heat dissipating fin corresponding to a position of said heat conductor; and    integrating said heat conductor with said heat dissipating fin by passing said heat conductor through said aperture on said heat dissipating fin and combining said heat conductor and said heat dissipating fin under a room temperature.    
   
   
       2 . The method according to  claim 1 , wherein said low-temperature treatment step and said heat treatment step are proceeded simultaneously.  
   
   
       3 . The method according to  claim 1 , wherein said low-temperature treatment step is proceeded after said heat treatment step.  
   
   
       4 . The method according to  claim 1 , wherein said low-temperature treatment step and said heat treatment step are proceeded before step c).  
   
   
       5 . The method according to  claim 1 , wherein said heat conductor is a heat tube.  
   
   
       6 . The method according to  claim 1 , wherein said heat conductor is a copper pillar.  
   
   
       7 . The method according to  claim 1 , wherein said aperture on said heat dissipating fin has an inside diameter which is larger than or equal to an outer diameter of said heat conductor so that said heat conductor can easily passes through said aperture of said heat dissipating fin to be combined therewith.  
   
   
       8 . A method for integrating a heat conductor with a heat dissipating fin, comprising steps of: 
 a) employing a low-temperature treatment to an area of said heat conductor so as to generate a shape contraction thereof, wherein said area is a connecting area between said heat conductor and said heat dissipating fin, and said heat dissipating fin has an aperture mounted thereon and is maintained at a room temperature; and    b) integrating said heat conductor with said heat dissipating fin by passing said heat conductor through said aperture on said heat dissipating fin and combining said heat conductor and said heat dissipating fin under said room temperature.    
   
   
       9 . The method according to  claim 8 , wherein said heat conductor is a heat tube.  
   
   
       10 . The method according to  claim 8 , wherein said heat conductor is a copper pillar.  
   
   
       11 . A method for integrating a heat conductor with a heat dissipating fin, comprising steps of: 
 a) maintaining said heat conductor under a room temperature and employing a heating treatment to said heat dissipating fin to generate a shape expansion thereof, and opening an aperture on said heat dissipating fin corresponding to a position of said heat conductor; and    b) integrating said heat conductor with said heat dissipating fin by passing said heat conductor through said aperture on said heat dissipating fin and combining said heat conductor and said heat dissipating fin under said room temperature.    
   
   
       12 . The method according to  claim 11 , wherein said heat conductor is a heat tube.  
   
   
       13 . The method according to  claim 11 , wherein said heat conductor is a copper pillar.