Modular semiconductor workpiece processing tool

Abstract

The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.

1 - 4 . (canceled)  
   
   
       5 . A head assembly for holding a microelectronic workpiece in electrochemical processing, comprising: 
 a motor having a rotor axis;    a support coupled to the motor to rotate about the rotor axis, the support being configured to carry a microelectronic workpiece facedown in a workpiece processing plane generally normal to the rotor axis; and    a plurality of electrical contacts carried by the support, the electrical contacts having first sections outside of a workpiece zone where a workpiece is positioned relative to the support and second sections projecting from the first sections into a perimeter area of the workpiece zone, wherein individual second sections of the electrical contacts have (a) an inclined portion extending at an inclined angle relative to the workpiece processing plane and (b) a conductive contact region configured to press against a surface of the workpiece upon which electrochemical processing is to occur.    
   
   
       6 . The head assembly of  claim 5  wherein the first sections of the electrical contacts project from the support member to a level beyond the workpiece processing plane and the second sections project from the first sections toward the workpiece processing plane.  
   
   
       7 . The head assembly of  claim 5  wherein the inclined portions of the second sections of the electrical contacts are sloped toward the workpiece processing plane.  
   
   
       8 . A tool for electrochemical processing of microelectronic workpieces, comprising: 
 a chamber;    a head assembly aligned with the chamber, the head assembly including a motor having a rotor axis, a support coupled to the motor to rotate about the rotor axis, and a plurality of electrical contacts carried by the support, wherein 
 the support is configured to carry a microelectronic workpiece facedown in a workpiece processing plane generally normal to the rotor axis, and  
 the contacts have first sections outside of a workpiece zone where a workpiece is positioned relative to the support and second sections projecting from the first sections, and wherein individual second sections of individual electrical contacts have (a) an inclined portion extending at an inclined angle relative to the workpiece processing plane and (b) a conductive contact region configured to press against a surface of the workpiece upon which electrochemical processing is to occur.  
   
   
   
       9 . The tool of  claim 8  wherein the first sections of the electrical contacts project from the support member to a level beyond the workpiece processing plane and the second sections project from the first sections toward the workpiece processing plane.  
   
   
       10 . The tool of  claim 8  wherein the inclined portions of the second sections are sloped toward the workpiece processing plane.