Full-wafer or large area imprinting with multiple separated sub-fields for high throughput lithography

Abstract

The present invention is directed to a method of forming a layer on a substrate comprising forming a plurality of flowable regions on the substrate and contacting the flowable regions with a plurality of molds disposed on a template. Thereafter, the plurality of flowable regions is solidified. In a further embodiment, the method further includes spreading each of the plurality of flowable regions to an area.

1 . A method of forming a layer on a substrate, said method comprising: 
 forming a plurality of flowable regions on said substrate;    contacting said flowable regions with a plurality of molds disposed on a template; and    solidifying said plurality of flowable regions.    
     
     
         2 . The method as recited in  claim 1 , wherein forming further includes forming said plurality of flowable regions as an integer multiple of said plurality of molds.  
     
     
         3 . The method as recited in  claim 1  further including spreading a material in said plurality of flowable regions over said substrate while confining said material associated with each of said plurality of flowable regions to an area.  
     
     
         4 . The method as recited in  claim 1 , wherein contacting further includes flexing said template to conform to a topography of said substrate.  
     
     
         5 . The method as recited in  claim 1 , wherein solidifying further includes applying electromagnetic activation energy to said plurality of flowable regions.  
     
     
         6 . The method as recited in  claim 1 , wherein contacting further includes flexing said template at a region between adjacent molds of said plurality of molds.  
     
     
         7 . The method as recited in  claim 1 , wherein forming further includes forming said plurality of flowable regions concurrently.  
     
     
         8 . The method as recited in  claim 1 , wherein forming further includes forming each of said plurality of flowable regions to be spaced-apart from adjacent flowable regions of said plurality of flowable regions.  
     
     
         9 . A method of forming a layer on a substrate, said method comprising: 
 forming a plurality of flowable regions on a surface of said substrate;    providing each of said plurality of flowable regions with a surface having a desired shape; and    solidifying said plurality of flowable regions.    
     
     
         10 . The method as recited in  claim 9 , wherein providing further includes contacting said plurality of flowable regions with a plurality of molds disposed on a template.  
     
     
         11 . The method as recited in  claim 10 , wherein forming further includes forming said plurality of flowable regions as an integer multiple of said plurality of molds.  
     
     
         12 . The method as recited in  claim 10 , wherein contacting further includes flexing said template to conform to a topography of said substrate.  
     
     
         13 . The method as recited in  claim 9 , wherein solidifying further includes applying electromagnetic activation energy to said plurality of flowable regions.  
     
     
         14 . The method as recited in  claim 10 , wherein contacting further includes flexing said template at a region between adjacent molds of said plurality of molds.  
     
     
         15 . The method as recited in  claim 9  further including spreading a material in said plurality of flowable regions over said substrate while confining said material associated with each of said plurality of flowable regions to an area.  
     
     
         16 . A method of forming a layer on a substrate, said method comprising: 
 forming a plurality of flowable regions on said substrate;    spreading a material in said plurality of flowable regions over said substrate while confining said material associated with each of said plurality of flowable regions to an area;    contacting said flowable regions with a plurality of molds disposed on a template; and    solidifying said plurality of flowable regions.    
     
     
         17 . The method as recited in  claim 16 , wherein forming further includes forming said plurality of flowable regions as an integer multiple of said plurality of molds.  
     
     
         18 . The method as recited in  claim 16 , wherein contacting further includes flexing said template to conform to a topography of said substrate.  
     
     
         19 . The method as recited in  claim 16 , wherein solidifying further includes applying electromagnetic activation energy to said plurality of flowable regions.  
     
     
         20 . The method as recited in  claim 16 , wherein contacting further includes flexing said template at a region between adjacent molds of said plurality of molds.