Miniature fluid-cooled heat sink with integral heater

Abstract

A temperature control device that includes a miniature liquid-cooled heat sink with integral heater and sensing elements is used as part of a system to provide a controlled temperature surface to an electronic device, such as a semiconductor device, during the testing phase. The temperature control device includes an interface surface configured to provide a thermal path from the device to a device under test. One such device has a liquid-cooled heat sink comprising a first heat transfer portion in a first plane and a second heat transfer portion in a second plane. The first and second heat transfer portions establish a three-dimensional cross-flow of coolant within the heat sink structure. An alternate embodiment includes parallel fluid conduits, each having a three-dimensional microchannel structure that directs coolant flow in three dimensions within the fluid conduits. Coolant flows in opposite directions through adjacent fluid conduits, thus resulting in a three-dimensional cross-flow within the heat sink structure.

1 . A temperature control device comprising: 
 an interface surface configured to provide a thermal path to a device under test (“DUT”);    a fluid-cooled heat sink having a first heat transfer portion in a first plane and a second heat transfer portion in a second plane, said first plane being closer to said interface surface than said second plane; and    one or more integral heater assemblies.    
   
   
       2 . A temperature control device according to  claim 1 , further comprising one or more thermal sensing elements.  
   
   
       3 . A temperature control device according to  claim 1 , wherein said first heat transfer portion includes one or more flow channels and said second heat transfer portion includes one or more flow channels.  
   
   
       4 . A temperature control device according to  claim 1 , wherein said first heat transfer portion has a flow path in a first direction and said second heat transfer portion has a flow path in a second direction.  
   
   
       5 . A temperature control device according to  claim 4 , wherein said flow path in said first direction is opposite to said flow path in said second direction.  
   
   
       6 . A temperature control device according to  claim 1 , wherein said one or more integral heater assemblies are planar and parallel to said interface surface.  
   
   
       7 . A temperature control device according to  claim 1 , wherein said one or more integral heater assemblies includes a substrate and at least one heating element formed on said substrate.  
   
   
       8 . A temperature control device according to  claim 7 , wherein said at least one heating element comprises one or more electrically resistive serpentine traces.  
   
   
       9 . A temperature control device according to  claim 1 , wherein each of said one or more integral heater assemblies has an independently adjustable power level.  
   
   
       10 . A temperature control device comprising: 
 an interface surface configured to provide a thermal path to a device under test (“DUT”);    a fluid-cooled heat sink structure configured to maintain a cross-flow of coolant in three dimensions for cooling said interface surface; and    a heater assembly configured to heat said interface surface.    
   
   
       11 . A temperature control device according to  claim 10 , wherein said fluid-cooled heat sink structure comprises: 
 a first fluid conduit for accommodating coolant flow in a first direction;    a first three-dimensional microchannel structure located within said first fluid conduit, said first microchannel structure being configured to direct coolant flow in three dimensions within said first fluid conduit;    a second fluid conduit for accommodating coolant flow in a second direction different than said first direction; and    a second three-dimensional microchannel structure located within said second fluid conduit, said second microchannel structure being configured to direct coolant flow in three dimensions within said second fluid conduit.    
   
   
       12 . A temperature control device according to  claim 11 , wherein said first and second fluid conduits are coplanar.  
   
   
       13 . A temperature control device according to  claim 12 , wherein said first and second fluid conduits are adjacent to each other.  
   
   
       14 . A temperature control device according to  claim 11 , wherein: 
 said first fluid conduit is located above said second fluid conduit; and    said first and second fluid conduits are located above said interface surface.    
   
   
       15 . A temperature control device according to  claim 10 , wherein said heater assembly is located between said interface surface and said fluid-cooled heat sink structure.  
   
   
       16 . A temperature control device according to  claim 10 , wherein said fluid-cooled heat sink structure comprises: 
 a first layer;    a second layer below said first layer;    a first plurality of flow channels, formed in said first layer, for accommodating coolant flow within said fluid-cooled heat sink structure; and    a second plurality of flow channels, formed in said second layer, for accommodating coolant flow within said fluid-cooled heat sink structure.    
   
   
       17 . A temperature control device according to  claim 16 , wherein said first and second layers are parallel to each other.  
   
   
       18 . A temperature control device according to  claim 16 , wherein: 
 said first plurality of flow channels are configured to maintain a first flow path having a first direction; and    said second plurality of flow channels are configured to maintain a second flow path having a second direction different than said first direction.    
   
   
       19 . A temperature control device according to  claim 18 , wherein said first flow path is opposite to said second flow path.  
   
   
       20 . A temperature control device comprising: 
 an interface surface configured to provide a thermal path to a device under test (“DUT”); and    a fluid-cooled heat sink structure configured to maintain a cross-flow of coolant in three-dimensions for cooling said interface surface, said fluid-cooled heat sink structure comprising: 
 a first fluid conduit for accommodating coolant flow in a first direction;  
 a first three-dimensional microchannel structure located within said first fluid conduit, said first microchannel structure being configured to direct coolant flow in three dimensions within said first fluid conduit;  
 a second fluid conduit for accommodating coolant flow in a second direction different than said first direction; and  
 a second three-dimensional microchannel structure located within said second fluid conduit, said second microchannel structure being configured to direct coolant flow in three dimensions within said second fluid conduit.  
   
   
   
       21 . A temperature control device according to  claim 20 , further comprising a heater assembly configured to heat said interface surface.  
   
   
       22 . A temperature control device according to  claim 20 , wherein said first and second fluid conduits are coplanar.  
   
   
       23 . A temperature control device according to  claim 20 , wherein: 
 said first fluid conduit is located above said second fluid conduit; and    said first and second fluid conduits are located above said interface surface.